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Circuit board materials which provide customers with appropriate solutions for a wide range of heat dissipation applications.
Inorganic resin circuit boards which realize an excellent processability and a design flexibility as well as an excellent cost performance.
Line-up of products of single/double-sided copper clad type, flexible type, multi-layered type, seat type.
Circuit Board Materials
Circuit board material thermal characteristics
General properties
| Item | Unit | ECOOL R-1787 |
Our conventional FR-4 R-1705 |
|---|---|---|---|
| UL/ANSI grade | ― | CEM-3 | FR-4.0 |
| Dielectric layer thickness | mm | 1.0 | 1.0 |
| Thermal conductivity*1 | W/m･K | 1.1 | 0.4 |
| Thermal resistance | ℃/W | 6.7 | 17.5 |
Condition : As received
*1 Laser flash method
The above data are typical values and not guaranteed values.
