Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series

Zoom
Secondary mounting reinforcement of semiconductor package
such as CSP/BGA, Adhesive bonding of camera module/image sensor

Semiconductor Encapsulation Materials

  • High heat resistance Secondary mounting Sidefill materials
    CV5797
  • High heat resistance Secondary mounting Underfill materials
    CV5794
  • Low-temperature curing Secondary mounting Underfill materials
    CV5350AS
  • For secondary mounting reinforcement Drop impact resistance
    liquid encapsulant CV5313, CV5314
  •  

Line up


Application Our proposal
CSP / BGA / Image Sensor
WLPCSP / QFN / MLCC, etc
Power device

High heat resistance Secondary mounting Sidefill materials
CV5797

For large size PKG Tg 160°C Pot life 72h Frozen storage Easy to inspect

High heat resistance Secondary mounting Underfill materials
CV5794

Tg 160°C Pot life 72h Frozen storage

Low-temperature curing Secondary mounting Underfill materials
CV5350AS

Cures at a low temp of 80°C Tg is 150°C or greater High fluidity

For secondary mounting reinforcement Drop impact resistance liquid encapsulant
CV5313, CV5314

Drop impact resistance Underfill/Sidefill reinforcement

Surface Mount Assembly Reinforcement Type for PKGs

  

Necessity of Reinforcement for Automotive Electronic Components (Solder Crack Causes)

Related information