Semiconductor Device Materials

Product List

• IC Substrate Materials "LEXCM GX" series
• Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
• Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
• Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series

공지 사항

[ 2023 ]

• 10월
  18일
  Information
  Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment
• 3월
  16일
  Information
  Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments

[ 2022 ]

• 6월
  22일
  Information
  Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications

[ 2021 ]

• 6월
  22일
  New product
  Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
• 3월
  2일
  New product
  Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement

News list