High thermal conductive Bonding sheet | R-14T1

High thermal conductive Bonding sheet R-15T1

 

  1. This high thermal conductive bonding sheet will contribute to light weight of product and thermal dissipation at parts of heat generation.

Circuit Board Materials

  • Part Number

R-14T1

  • Application
  • Detailed use
Automotive
Appliance
・Automotive
・Appliance
Heat dissipation of Automotive application(LED lighting), Industry equipment, etc.

Properties

Thermal Conductivity
1.4W/m・K
CTI≧600V
Halogen-free

Thermal dissipation property

Thermal dissipation property

Line-up

Line-up

General properties

Item Test method Condition Unit R-14T1 Conventional
R-1661
Thermal conductivity Laser flash A W/m・K 1.4 0.4
Glass transition temp.(Tg) DSC A 148 140
Thermal decomposition temp.(Td) TGA A 350 315
CTE x-axis α1 IPC-TM-650 2.4.41 C-24/23/50 ppm/℃ 19-21 11-13
CTE y-axis 19-21 13-15
CTE z-axis IPC-TM-650 2.4.24 27 65
Tracking resistance IEC 60112 A V ≧600 175-249
Flexural modulus Fill JIS C 6481 A GPa 25 21
Flexural strength Fill JIS C 6481 A MPa 230 490

The sample thickness is 0.08mm(RC:86%)

The above data are typical values and not guaranteed values.