R-1566(WN)/R-1551(WN) : 无卤环氧玻璃多层基板材料「Halogen-free」系列
产品名
无卤环氧玻璃多层基板材料「Halogen-free」系列
系列/类型
Halogen-free Multi-layer circuit board materials
型号
R-1566(WN)/R-1551(WN)
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资料
请事先务必阅读注意事项
特性值
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项目
内容
Glass transition temp.(Tg) :DSC (°C)
148
Glass transition temp.(Tg) :TMA (°C)
145
Glass transition temp.(Tg) :DMA (°C)
170
Thermal decomposition temp.(Td):TGA (°C)
355
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min)
>120
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min)
10
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)
11-13
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)
11-15
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
40
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
180
Thermal conductivity:Laser flash,25˚C (W/m·K)
0.62
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)
1 x 10⁹
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ)
1 x 10⁸
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
4.9
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
4.6
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
4.6
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50
-
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
0.01
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
0.01
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
0.016
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50
-
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)
0.14
Flexural modulus,Warp/MD:JIS C 6481 (GPa)
24
Flexural modulus,Fill/TD:JIS C 6481 (GPa)
22
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))
1.8(10.3)
Flammability:UL,C-48/23/50
94V-0
The sample thickness
0.8mm
The above data are typical values and not guaranteed values.
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*1 Test method: TMA
-
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文档
[目录/资料]
Catalog_R-1566_W_WN.pdf(196KB)
DataSheet_R-1566W_WN_1906.pdf(251KB)
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