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无卤环氧玻璃多层基板材料「Halogen-free」系列 : 型号

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数据表		 系列/类型 Glass transition temp.(Tg) :DSC
(°C) 		Glass transition temp.(Tg) :TMA
(°C) 		Glass transition temp.(Tg) :DMA
(°C) 		Thermal decomposition temp.(Td):TGA
(°C) 		Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
(min)		 Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
(min)		 CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 Thermal conductivity:Laser flash,25˚C
(W/m·K)		 Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)		 Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ)		 Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)		 Flexural modulus,Warp/MD:JIS C 6481
(GPa)		 Flexural modulus,Fill/TD:JIS C 6481
(GPa)		 Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))		 Flammability:UL,C-48/23/50 The sample thickness The above data are typical values and not guaranteed values. *1 Test method: TMA
R-1566(W)/R-1551(W)
 Halogen-free Multi-layer circuit board materials 148 145 170 350 >120 3 11-13 11-15 40 180 0.62 1 x 10⁹ 1 x 10⁸ 4.9 4.6 4.6 - 0.01 0.01 0.016 - 0.14 24 22 1.8（10.3） 94V-0 0.8mm - -
R-1566(WN)/R-1551(WN)
 Halogen-free Multi-layer circuit board materials 148 145 170 355 >120 10 11-13 11-15 40 180 0.62 1 x 10⁹ 1 x 10⁸ 4.9 4.6 4.6 - 0.01 0.01 0.016 - 0.14 24 22 1.8（10.3） 94V-0 0.8mm - -
R-1566/R-1551
 Halogen-free Multi-layer circuit board materials 148 - - 350 - - - - 40 180 - - - - - - - - - - - - - - 1.8 - 0.8mm - -
R-1566S/R-1551S
 Highly heat resistant Halogen-free Multi-layer circuit board materials 175 170 170 355 >120 10 11-13 13-15 40 180 - 1 x 109 1 x 108 5 4.7 - - 0.011 0.011 - - 0.18 - - 1.6 94V-0 0.8mm - -
R-3566D/R-3551D
 High CTI, High RTI Halogen-free multi-layer circuit board materials 175 170 - 355 - - - - 40 180 - - - - - - - - - - - - - - 1.6 94V-0 0.8mm - -
R-A555(W)/R-A550(W)
 Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials - 160 200 380 >60 >60 11-13 11-15 41 270 0.4 1 x 10⁹ 1 x 10⁸ - 3.4 3.2 - - 0.008 0.011 - 0.07 26 24 - 94V-0 0.8mm - -
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