松下在电子化急剧发展的车载领域，为客户提供符合客户需求的元器件。
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电容器
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电子材料
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6
- Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials XPEDION1
- Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type> HIPER D
- Highly heat resistant Low CTE Multi-layer circuit board materials <Middle-Tg type> HIPER M
- Highly heat resistant Low CTE Multi-layer circuit board materials HIPER E
- High thermal conductivity Glass composite circuit board materials ECOOL
- Flexible circuit board materials FELIOS
- Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP
- Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials
- High reliability Glass composite Circuit board materials
- High heat resistance Secondary mounting Sidefill materials
- High heat resistance Secondary mounting Underfill materials
- 低温固化二次实装底部填充材料
- For secondary mounting reinforcement drop impact resistance liquid encapsulant
- For power modules high thermal conductive semiconductor encapsulation materials
- For high heat resistance power devices semiconductor encapsulation materials
- For LED (optical parts) light diffusion/reflection PP molding compounds FULL BRIGHT PP
- 车载设备用 高耐热苯酚树脂成型材料
- 车载设备用 长期可靠性PBT树脂成型材料
- Anti-Glare Type Anti-Reflection Films
- Clear Type Anti-Reflection Films
- Moldable Low-Reflection Films
- Anti-Rainbow and Anti-Blackout Films
- Thermal Insulation Optical Films