- ICT infrastructure equipment,Antenna
- IC package
- LED lightings
- Mobile products
- Automotive components
- Industrial equipment Appliance Amusement, etc
Each application of Mobile products
Smart phone, Tablet PC
Main board
| Product category | Product name | Product number | Features / Proposals | |
|---|---|---|---|---|
| Halogen-free multi-layer circuit board materials |  | Laminate : R-1566(W/WN) Prepreg : R-1551(W/WN) |
|
| Low Dk halogen-free multi-layer circuit board materials | | Laminate : R-A555(W) Prepreg : R-A550(W) |
|
IC package
| Product category | Product name | Product number | Features / Proposals | |
|---|---|---|---|---|
| Ultra-thin circuit board materials |  | Laminate : R-151YE, R-1515E Prepreg : R-141YE, R-1410E |
|
Various modules, Connector
| Product category | Product name | Product number | Features / Proposals | |
|---|---|---|---|---|
| LCP flexible circuit board materials |  | Double-sided copper clad : R-F705S |
|
| Flexible circuit board materials resin coated copper foil |  | Material for thinner and multilayed : R-FR10 |
|
Touch panel
| Product category | Product name | Product number | Features / Proposals | |
|---|---|---|---|---|
| Anti-Reflection Films | Anti-Glare Type MUAG8 Clear Type MUAR5 |
| |
Semiconductor Encapsulation, Surface Mount Assembly Reinforcement, Adhesion
PoP, MUF
| Product category | Product name | Product number | Features / Proposals | |
|---|---|---|---|---|
| Thin surface mounting semiconductor encapsulation materials |  | CV8710 CV8760 |
|
QFP/SOP, BGA/CSP
| Product category | Product name | Product number | Features / Proposals | |
|---|---|---|---|---|
| Capillary Underfill(CUF) Semiconductor encapsulation materials |  | CV5300 series |
|
NCP, CUF
| Product category | Product name | Product number | Features / Proposals | |
|---|---|---|---|---|
| Capillary Underfill(CUF) Semiconductor encapsulation materials | | CV5300 series |
|
Large encapsulation area
| Product category | Product name | Product number | Features / Proposals | |
|---|---|---|---|---|
| For SMD module low warpage liquid encapsulant | | CV5386 CV5401 |
|