Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials | R-A555(W)

Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials R-A555(W)

 

  1. Good impedance matching at ultra-thin insulated layer with low Dk property.
  2. Contribute to thinner and compact of mobile product.

Circuit Board Materials

  • Part Number

LaminateR-A555(W)
PrepregR-A550(W)

Halogen-free
  • Application
  • Detailed use
Mobile
Automotive
・Mobile
・Automotive
Smartphone, Tablet PC, In-vehicle autonomous driving server,etc.

Properties

Dk 3.4 @2GHz
(Resin content 70wt%)
CTE z-axis
41ppm/°C
Tg (DMA)
200°C

Impedance simulation (Strip Line)

Impedance simulation (Strip Line)

Halogen-free material mapping

Halogen-free material mapping

General properties

Item Test method Condition Unit Halogen-free
R-A555(W)
Conventional
Halogen-free
R-1566(W)
Glass transition temp. (Tg) DMA A °C 200 170
CTE z-axis α1 IPC-TM-650 2.4.24 A ppm/°C 41 52
α2 270 300
T288 (with copper) IPC-TM-650 2.4.24.1 A min >60 3
Dielectric constant (Dk)* 2GHz IPC-TM-650 2.5.5.5 C-24/23/50 3.4
Dissipation factor (Df)* 0.010
UL/ANSI grade FR-4.1 FR-4.1

The sample thickness is 0.8mm.
* Resin content:70wt%

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.