HIPER C: High reliability glass epoxy multi-layer materials R-1755C

HIPER C

Appication Features

Appication

  • Automotive components, PC-related equipment, Digital consumer-electronics equipment, etc.

Features

  • Excellent heat resistance and insulation resistance
  • 20% lower CTE than our conventional FR-4
  • Excellent CAF resistance (120°C 85% DC50%)
  • Mid loss DF (0.015) @1GHz
  • Lead-Free soldering RoHS compliant
  • Excellent heat resistance
    Tg : 135°C (DSC)
    Td : 370°C (TGA)
    T288 : 35 minutes

Data Sheet

Characteristics

Through hole reliability

Through hole reliability
# The above are reference values only.

CAF Resistance

CAF Resistance
# The above are reference values only.

Heat Resistance

Heat Resistance
# The above are reference values only.

Dynamic Mechanical Analysis

Dynamic Mechanical Analysis
# The above are reference values only.

Peel Strength (Copper Foil thickness : 0.0018mm)

Peel Strength (Copper Foil thickness : 0.0018mm)
# The above are reference values only.

Process Guidelines

Product Information Sheet