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Flexible circuit board materials which meet the diverse mounting needs of mobile products such as smartphones and digital appliances.
Line-up of products with high frequency characteristics addition to dimensional stability.
Suitable for aerospace applications with low outgassing. (Compliant with ASTM E-595)
Circuit Board Materials
Application
Suggestion in each part of a smartphone
 |
Applications | Requirement | Product Suggestion | |
|---|---|---|---|---|
| ①Antenna, Antenna module |
Low-transmission loss | Dk:3.0 Pl:75µm(3mil) Pl:100µm(4mil) Pl:125µm(5mil) Pl:150µm(6mil) |
|
|
| ②LCD module | Impedance control Fine wiring |
Cu:2µm, 6µm Dk:3.0 |
|
|
| ③Battery module | High electric current safety |
Cu：105µm(3oz) |
|
|
| ④NFC & WPC module | High electric current, Current efficiency |
PI：75~150µm Cu：105µm(3oz) |
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Layer composition of rigid-flex board and suggestion of materials
