Our CSP MOSFETs in Ultra Small, Low Profile Package
Resin Sealed PKG
2.0 x 2.0mm
4.0mm2
43% miniaturization
CSP
1.5 x 1.5mm
2.3mm2
0.4mm
75% thinner
0.1mm
*Comparison of Panasonic parts with same on resistance rating
Use case
Suitable for small or thin form factor applications
Suitable for small appliances such as earphones, slim equipment such as bankcard.
Earphones
Smart card
Wearable