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Flexible Circuit Board Materials for Mobile Products "FELIOS" series : Models

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Datasheet		 Series/Type Copper Foil Copper Foil Thickness
(µm) 		Fiim Thickness
(µm) 		Total products thickness
(µm) 		Peel Strength.90°:JIS C 6471.A
(mm) 		Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
(mm) 		Dimensional Stability.MD:IPC-TM-650.After Etching
(%) 		Dimensional Stability.TD:IPC-TM-650.After Etching
(%) 		Dimensional Stability.MD:IPC-TM-650.Ｅ-0.5/150
(%) 		Dimensional Stability.TD:IPC-TM-650.Ｅ-0.5/150
(%) 		Soldering Resistance:JIS C 6471.A
(°C) 		Soldering Resistance:JIS C 6471.C-96/40/90
(°C) 		MIT Test:JIS C 6471.0.38R×4.9N,MD MIT Test:JIS C 6471.0.38R×4.9N,TD Tensile　Modulus:IPC-TM-650
(GPa) 		Coefficient of Thermal Expansion.MD:TMA　100℃→250℃，
5℃/min
(ppm/K) 		Coefficient of Thermal Expansion.TD:TMA　100℃→250℃，
5℃/min
(ppm/K) 		Dielectric Constant at 1MHz:IPC-TM-650　2.5.5.5.A Dielectric Constant at 2GHz:IPC-TM-650　2.5.5.5.A Dielectric Constant at 10GHz:Cavity resonance.A Dissipation Factor at 1MHz:IPC-TM-650　2.5.5.5.A Dissipation Factor at 2GHz:IPC-TM-650　2.5.5.5.A Dissipation Factor at 10GHz:Cavity resonance.A Insulation resistance:JIS C 6471.A
(Ω)		 Insulation resistance:JIS C 6471.C-96/40/90
(Ω)		 Water absorption.IPC-TM-650:JIS C 6471.D-24/23
(%) 		Water absorption:JIS C 6471.D-24/23
(%) 		Moisture Absorption.IPC-TM-650:C-24/23/50
(%) 		Tg:DMA.A
(°C) 		Flammability:UL 94.A+E-168/70 * These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.		 Glass transition temp.(Tg) :TMA(Ad)
(°C) 		Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad)
(°C) 		CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)		 Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)		 Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))		 Flammability:UL,A+E-168/70 The sample thickness *1 Condition: C-96/20/65, Unit : MΩ·m *2 Condition: E-24/50+D-24/23 *3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
R-FR10
 Flexible circuit board materials Resin coated copper foil FELIOS FRCC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 190 210 80(Ad) 80(Ad) 80(Ad) 580(Ad) 1 x 10<sup>8</sup> *2 3 0.019 1.2 *4 0.8(4.6)
(ED:12μm)		 94VTM-0 *5 0.032mm
(Cu:12μm, PI:5μm,Ad:15μm)		 - - -
R-F705S_12EC_18-25-18(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 18 25 61 0.8 0.8 0.024 -0.006 0.07 0.015 310 290 220 190 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_13EC_12-25-12(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 12 25 49 0.75 0.75 0.019 -0.021 0.054 -0.01 310 290 280 290 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_14EC_9-25-9(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 9 25 43 0.65 0.65 0.032 0.001 0.088 0.036 310 290 70 60 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_22EC_18-50-18(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 18 50 86 0.8 0.8 0.016 -0.038 0.05 -0.035 310 290 110 100 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_23EC_12-50-12(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 12 50 74 0.75 0.75 -0.004 -0.058 -0.002 -0.073 310 290 85 70 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_24EC_9-50-9(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 9 50 68 0.8 0.8 0.007 -0.053 0.04 -0.056 310 290 60 50 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_32EC_18-75-18(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 18 75 111 0.8 0.8 0.064 0.042 0.121 0.094 310 290 32 28 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_33EC_12-75-12(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 12 75 99 0.75 0.75 0.021 0.006 0.028 0.004 310 290 22 16 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_34EC_9-75-9(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 9 75 93 0.65 0.65 -0.003 0.017 0.045 0.054 310 290 20 15 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_42EC_18-100-18(ED
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 18 100 136 0.8 0.8 0.007 -0.002 0.034 0.021 310 290 16 12 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_43EC_12-100-12(ED
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 12 100 124 0.75 0.75 -0.016 -0.049 0.009 -0.052 310 290 11 8 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_44EC_9-100-9(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 9 100 118 0.65 0.65 0.021 0.02 0.06 0.044 310 290 8 8 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_A2EC_18-125-18(ED
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 18 125 161 0.75 0.75 0.0463 0.0354 0.0996 0.0765 310 290 6 6 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_A3EC_12-125-12(ED
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 12 125 149 0.75 0.75 0.02 -0.005 0.067 0.035 310 290 4 4 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_B2EC_18-150-18(ED
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 18 150 186 0.75 0.75 0.023 0.028 0.067 0.078 310 290 3 3 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F705S_B3EC_12-150-12(ED
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP（Double-sided copper clad） ED
TP4-S		 12 150 174 0.75 0.75 0.0301 0.0102 0.0821 0.0762 310 290 3 3 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_12EC_18-25-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 18 25 43 0.8 0.8 0.058 0.021 0.092 0.064 310 290 255 250 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_13EC_12-25-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 12 25 37 0.75 0.75 0.036 0.01 0.082 -0.041 310 290 300 280 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_22EC_18-50-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 18 50 68 0.8 0.8 0.064 0.029 0.108 0.073 310 290 118 83 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_23EC_12-50-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 12 50 62 0.75 0.75 0.04 -0.039 0.089 -0.039 310 290 84 61 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_32EC_18-75-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 18 75 93 0.8 0.8 0.0265 0.0167 0.0717 0.0582 310 290 28 18 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_33EC_12-75-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 12 75 87 0.75 0.75 0.033 0.002 0.072 0.017 310 290 28 18 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_43EC_12-100-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 12 100 112 0.75 0.75 -0.018 -0.036 0.009 -0.029 310 290 10 8 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_A3EC_12-125-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 12 125 137 0.75 0.75 0.0278 0.0156 0.077 0.0375 310 290 4 4 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F700S_B3EC_12-150-0(ED)
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP (Single-sided copper clad） ED
TP4-S		 12 150 162 0.75 0.75 0.0424 0.0285 0.0973 0.0713 310 290 3 3 4.5 18 18 - - 3.3 - - 0.002 ＞1.0×10^14 ＞1.0×10^14 - 0.04 - - VTM-0 - - - - - - - - - - - - - - - - -
R-F775_10RB_70-25-70(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY		 70 25 165 2.5 2.5 -0.055 -0.008 -0.105 -0.028 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_11EM_35-25-35(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
T4M-HDR		 35 25 95 1.8 1.8 -0.007 -0.001 -0.051 -0.051 330 260 110 100 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_11RB_35-25-35(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY		 35 25 95 1.6 1.6 -0.019 0.001 -0.045 -0.027 330 260 270 220 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_12EV_18-25-18(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
VLP		 18 25 61 1.5 1.5 0.008 0.012 0.007 0.009 330 260 170 160 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_12RB_18-25-18(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY		 18 25 61 1.5 1.5 0.0172 0.0297 0.0116 0.0088 340 270 220 230 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_13EV_12-25-12(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
VLP		 12 25 49 1.5 1.5 0.005 0.017 -0.004 0.008 330 260 170 160 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_13RX_12-25-12(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHYX-T		 12 25 49 1.5 1.5 -0.004 0.02 -0.032 -0.008 330 260 200 260 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_14EV_9-25-9(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
VLP		 9 25 43 1.3 1.3 0.008 0.017 -0.002 0.007 330 260 170 170 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_14RN_9-25-9(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY-HA-V2		 9 25 43 1.3 1.3 0.025 0.025 -0.004 -0.011 330 260 340 340 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_14RS_9-25-9(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHYA-HS		 9 25 43 1.3 1.3 -0.02 0.032 -0.049 0.0064 330 260 100 110 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_16ES_6-25-6(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
SEED		 6 25 37 1 1 -0.004 0.009 -0.024 0.002 330 260 170 170 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_17RN_105-25-105(RA
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY-HA-V2		 105 25 235 1.5 1.5 -0.0164 0.0122 -0.0523 -0.0193 330 260 34 31 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_1PEL_2-25-2(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
MT18FL		 2 25 29 1.3 1.3 -0.035 0.001 -0.041 -0.007 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_20RB_70-50-70(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY		 70 50 190 1.1 1.1 -0.044 -0.011 -0.082 -0.046 330 260 26 26 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_21EM_35-50-35(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
T4M-HDR		 35 50 120 2.5 2.5 -0.018 0.018 -0.038 -0.001 330 260 45 40 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_21RB_35-50-35(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY		 35 50 120 1.5 1.6 0.0222 0.0286 0.019 0.001 330 260 35 40 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_22EV_18-50-18(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
VLP		 18 50 86 1.6 1.6 0.009 0.02 0.0082 0.013 330 260 35 35 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_22RB_18-50-18(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY		 18 50 86 1.5 1.5 0.0233 0.0069 0.0072 0.0072 330 260 60 60 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_23EV_12-50-12(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
VLP		 12 50 74 1.7 1.7 0.002 0.01 -0.021 -0.019 330 260 40 40 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_23RX_12-50-12(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHYX-T		 12 50 74 1.3 1.3 -0.011 -0.008 -0.022 -0.017 330 260 46 60 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_24EV_9-50-9(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
VLP		 9 50 68 1.7 1.7 -0.015 0.022 -0.033 -0.008 330 260 40 40 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_24RS_9-50-9(RA)
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHYA-HS		 9 50 68 1.2 1.2 -0.01 0.002 -0.036 -0.026 330 260 30 16 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_26ES_6-50-6(ED)
 Flexible circuit board materials FELIOS（Double-sided copper clad） ED
SEED		 6 50 62 1 1 0.024 0.027 -0.002 0.009 330 260 40 40 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_27RN_105-50-105(RA
 Flexible circuit board materials FELIOS（Double-sided copper clad） RA
BHY-HA-V2		 105 50 260 3 3 -0.0106 -0.027 -0.0518 -0.062 330 250 26 26 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
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