Low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON4S, MEGTRON4 | R-5725S, R-5725

Low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON4S MEGTRON4 R-5725(S) R-5725

 

  1. Suitable for high-speed large-volume data transmission of server and router at High-end/Volume zone.

Circuit Board Materials

  • Part Number

Laminate R-5725S
Prepreg R-5620S

Laminate R-5725
Prepreg R-5620

  • Application
  • Detailed use
Network
Wireless
・Network
・Wireless
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna, Etc.

Properties

Dk 3.8 Df 0.007
@10GHz
Tg(DSC)
R-5725S 200°C
R-5725   176°C
T288(with copper)
R-5725S 50min
R-5725   30min

Transmission loss performance Ranking in MEGTRON series

Transmission loss performance Ranking in MEGTRON series

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

Heat resistance of High Multi-layer

Heat resistance of High Multi-layer

Dielectric property

Dielectric property

Solder heat resistance(float)

Solder heat resistance(float)

IST(Interconnect Stress Test)

IST(Interconnect Stress Test)

General properties

Item Test method Condition Unit MEGTRON4
R-5725
MEGTRON4S
R-5725S
Glass transition temp.(Tg) DSC A °C 176 200
Thermal decomposition temp.(Td) TGA A °C 360 360
CTE x-axis α1 IPC-TM-650 2.4.24 A ppm/°C 12-14 12-14
CTE y-axis 13-15 13-15
CTE z-axis α1 IPC-TM-650 2.4.24 A 35 32
α2 265 250
T288(with copper) IPC-TM-650 2.4.24.1 A min 30 50
Dielectric constant(Dk) 10GHz IPC-TM-650 2.5.5.5 C-24/23/50 3.8 3.8
Dissipation factor(Df) 0.007 0.007
Water absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.14 0.14
Flexural modulus Fill JIS C 6481 A GPa 23 23
Peel strength* 1oz(35μm) IPC-TM-650 2.4.8 A kN/m 1.1 1.3

The sample thickness is 0.8mm.
*RT Copper

The above data are typical values and not guaranteed values.