High reliability Glass composite Circuit board materials | R-1785

High reliability Glass composite Circuit board materials R-1785

 

  1. Improved solder joint reliability compared with conventional CEM-3 which has already good to safety and long-time reliability property.
    Contribute to high reliability PCB for electric car.

Circuit Board Materials

  • Part Number

Double-sided R-1785

  • Application
  • Detailed use
Automotive
Appliance
・Automotive
・Appliance
Automotive component, Power supply board, Power device module board, Infrastructure(Smart meter, IC tag), etc.

Properties

CTE x,y-axis
20ppm/℃
Tg (TMA)
150℃
CTI≧600V

Solder joint reliability

Solder joint reliability

CAF resistance

CAF resistance

General properties

Item Test method Condition Unit R-1785 Our conventional
CEM-3
Our conventional
FR-4
Glass transition temp. (Tg) TMA Temp. rising rate: 10°C/min °C 150 140 140
Solder heat resistance JIS C 6481 A
260°C solder float for 2min
No abnormality No abnormality No abnormality
CTE x-axis α1 IPC-TM-650 2.4.41 TMA ppm/°C 19 (15) 25 (20) 13
CTE y-axis   21 (17) 28 (23) 15
CTE z-axis α1 IPC-TM-650 2.4.24 TMA ppm/°C 50 65 65
Dielectric constant (Dk) 1MHz IPC-TM-650 2.2.2.9 C-96/20/65 4.5 4.5 4.8
Dissipation factor (Df) 0.019 0.015 0.015
Insulation resistance JIS C 6481 C-96/20/65 5×10 5×10 1×10
Tracking resistance IEC 60112 A V CTI≥600 CTI≥600 250>CTI≥175
Accuracy of thickness (σ value) A mm 0.013 0.013 0.027

The sample thickness is 1.6mm.
The figure in parentheses is for the thickness of 0.8mm.

The above data are typical values and not guaranteed values.