SEM Photos by Material and Device

Device SMD 3-Dimensional packaging technology Via ectching Silicon LSI Compound semiconductor MEMS Automotive SAW Power CMOS FeRAM LED device High-speed device Optical device Material Deep Si click click click   Poly-Si     click   Al click   click   Al (thick)     click   SiO2 click click click click Silicide     click   SiN     click click GaAs       click InP       click Pt, Ir, PZT, Ni compound click   click   Au click     click Polyimide       click W     click   Cu click       It is supported difficult-to-process such as quartz, crystal, SIC, sapphire, and so on. Quartz: 0.5μm/min SIC: 3.1μm/min