| Glass transition temp.(Tg) :TMA(Ad) (°C) |
- |
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad) (°C) |
- |
| CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) |
- |
| CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) |
- |
| CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) |
- |
| CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) |
- |
| Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) |
- |
| Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) |
- |
| Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) |
- |
| Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) |
- |
| Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) |
- |
| Flammability:UL,A+E-168/70 |
- |
| The sample thickness |
- |
| *1 Condition: C-96/20/65, Unit : MΩ·m |
- |
| *2 Condition: E-24/50+D-24/23 |
- |
| *3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction |
- |
| Copper Foil Type |
ED |
| Copper Foil Part No. |
TP4-S |
| Copper Foil Thickness (µm) |
9 |
| Fiim Thickness (µm) |
100 |
| Total products thickness (µm) |
118 |
| Peel Strength.90°:JIS C 6471.A (mm) |
0.65 |
| Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm) |
0.65 |
| Dimensional Stability.MD:IPC-TM-650.After Etching (%) |
0.021 |
| Dimensional Stability.TD:IPC-TM-650.After Etching (%) |
0.02 |
| Dimensional Stability.MD:IPC-TM-650.Ｅ-0.5/150 (%) |
0.06 |
| Dimensional Stability.TD:IPC-TM-650.Ｅ-0.5/150 (%) |
0.044 |
| Soldering Resistance:JIS C 6471.A (°C) |
310 |
| Soldering Resistance:JIS C 6471.C-96/40/90 (°C) |
290 |
| MIT Test:JIS C 6471.0.38R×4.9N,MD |
8 |
| MIT Test:JIS C 6471.0.38R×4.9N,TD |
8 |
| Tensile Modulus:IPC-TM-650 (GPa) |
4.5 |
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃，
5℃/min (ppm/K) |
18 |
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃，
5℃/min (ppm/K) |
18 |
| Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A |
- |
| Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A |
- |
| Dielectric Constant at 10GHz:Cavity resonance.A |
3.3 |
| Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A |
- |
| Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A |
- |
| Dissipation Factor at 10GHz:Cavity resonance.A |
0.002 |
| Insulation resistance:JIS C 6471.A (Ω) |
＞1.0×10^14 |
| Insulation resistance:JIS C 6471.C-96/40/90 (Ω) |
＞1.0×10^14 |
| Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%) |
- |
| Water absorption:JIS C 6471.D-24/23 (%) |
0.04 |
| Moisture Absorption.IPC-TM-650:C-24/23/50 (%) |
- |
| Tg:DMA.A (°C) |
- |
| Flammability:UL 94.A+E-168/70 |
VTM-0 |
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard. |
- |