Circuit Board Materials for LED lightings "ECOOL" series : Models

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Glass transition temp.(Tg) :TMA,Temp. rising rate: 10°C/min (°C)

Solder heat resistance:JIS C6481,260°C solder float for 2min

Heat resistance,1oz:JIS C6481

Dielectric constant (Dk):1MHz,JIS C 6481

Dissipation factor (Df):1MHz,JIS C 6481

Insulation resistance:JIS C6481,C-96/20/65 (MΩ)

Tracking resistance:IEC 60112 (V)

Thermal conductivity:Laser flash (W/m·K)

Flat-withstand voltage:ASTM D149 (kV/mm)

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Glass transition temp.(Tg) :TMA,Temp. rising rate: 10°C/min

Solder heat resistance:JIS C6481,260°C solder float for 2min

Heat resistance,1oz:JIS C6481

Dielectric constant (Dk):1MHz,JIS C 6481

Dissipation factor (Df):1MHz,JIS C 6481

Insulation resistance:JIS C6481,C-96/20/65

Tracking resistance:IEC 60112

Thermal conductivity:Laser flash

Flat-withstand voltage:ASTM D149

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Choice	Parts no	Catalog / Datasheet	Series/Type	Glass transition temp.(Tg) :TMA,Temp. rising rate: 10°C/min (°C)	Solder heat resistance:JIS C6481,260°C solder float for 2min	Heat resistance,1oz:JIS C6481	Dielectric constant (Dk):1MHz,JIS C 6481	Dissipation factor (Df):1MHz,JIS C 6481	Insulation resistance:JIS C6481,C-96/20/65 (MΩ)	Tracking resistance:IEC 60112 (V)	Thermal conductivity:Laser flash (W/m·K)	Flat-withstand voltage:ASTM D149 (kV/mm)
	R-1787		ECOOL High thermal conductivity Glass composite circuit board materials	140	No abnormality	230°C 60min	5.1	0.016	1x108	CTI≥600	1.10	43

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