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Circuit Board Materials for LED lightings "ECOOL" series
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UN38.3 Test Summary (for Lithium batteries)
Electronic Materials
●Inquiry of Irregularities in Third-party Certification
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
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Mass laminations(Shield board) "PreMulti"
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Paper Phenolic Circuit Board Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
Plastic Molding Compound for LED "FULL BRIGHT" series
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2.0x1.25x1.45 (1)
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EYF3CU
Chip Ring
1.6x0.8x1.15
2
50
EYF6CU
Chip Ring
2.0x1.25x1.45
2
50
EYF8CU
Chip Ring
3.2x1.16x1.25
2
50
