

Supporting high accuracy/density printing
Attack angle variable squeegee (option)
Top/side clamper (movable type) (option)
New operation panel
Enhancing automation and labor-saving functions
Paper-less cleaning (option)
Holed pot type automatic solder supply (option)
Support pin automatic exchange (option)
M2M Line solution
According to the correction data of shifted printing positions analyzed by solder paste inspection (APC correction data), it corrects printing positions(X ,Y ,θ).
*3D inspection equipment of other companies can also be connected.
*Please inquire with your sales representative for more details.

Model ID | SPG2 |
Model No. | NM-EJP1B |
PCB dimensions (mm) *1 | L 50 × W 50 to L 510 × W 510 |
PCB exchange time *2 | 14 sec including transfer, PCB positioning and recognition, printing and regular cleaning (when PCB is L250 × W150) |
Repeatability | 2Cpk ±4.0 μm 6σ (±3σ) (Under conditions specified by Panasonic) |
Printing accuracy | 2Cp ±15.0 μm 6σ (±3σ) (Under conditions specified by Panasonic) |
Screen frame dimensions (mm) *3 | L 736 × W 736、L 750 × W 750, L 650 × W 550、L 600 × W 550 L 550 × W 650、L 584 × W 584, L 736 × W 584、L 584 × W 736 |
Electric source *4 | 1-phase AC 200, 220, 230, 240 V ±10V (tap changing available) Max. 2.5 kVA |
Pneumatic source | 0.5 MPa, 30 L/min (A.N.R.) (Blower motor vacuum spec) , 400L/min (A.N.R.) (ejector vacuum spec) |
Dimensions (mm) *5 | W 1 580 × D 1 800 × H 1 500 |
Mass *6 | 1 600 kg |
- *1:The max PCB width changes when “Paper-less cleaning," “Support pin automatic exchange" or “Attack angle variable squeegee" has been selected.
For details, see specifications. - *2:PCB exchange time varies depending on the machine in the pre-process and the post process, the PCB size, the use of a PCB pressing-down unit and so forth.
- *3:For mask specifications, please see the specification.
- *4:Including blower and vacuum pump"Option"
- *5:Except for the signal tower and the touch panel.
- *6:With full options
*Values such as cycle time and accuracy may vary depending on operating conditions.
*Please refer to the "Specification booklet" for details.