| Glass transition temp.(Tg) :DSC (°C) |
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| Glass transition temp.(Tg) :TMA (°C) |
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| Glass transition temp.(Tg) :DMA (°C) |
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| Thermal decomposition temp.(Td):TGA (°C) |
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| Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min) |
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| Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min) |
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| CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) |
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| CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) |
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| CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) |
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| CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) |
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| Thermal conductivity:Laser flash,25˚C (W/m·K) |
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| Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) |
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| Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ) |
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| Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
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| Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 |
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| Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 |
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| Dielectric constant(Dk)@14GHz:Balanced-type circular disk resonator,C-24/23/50 |
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| Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
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| Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 |
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| Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 |
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| Dissipation factor(Df)@14GHz:Balanced-type circular disk resonator,C-24/23/50 |
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| Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) |
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| Flexural modulus,Warp/MD:JIS C 6481 (GPa) |
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| Flexural modulus,Fill/TD:JIS C 6481 (GPa) |
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| Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) |
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| Peel Strength,1oz(H-VLP3):IPC-TM-650 2.4.8 (kN/m) |
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| Flammability:UL,C-48/23/50 |
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| The sample thickness |
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| The above data are typical values and not guaranteed values. |
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| *1 Test method: TMA |
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