Low stress Low CTE Ultra-thin IC substrate materials | R-G525T , R-G525F

Low warpage circuit board materials MEGTRON GX R-G525

 

  1. Realize low warpage at several type of IC package by low stress property

Circuit Board Materials

  • Part Number

Low CTE glass cloth

Laminate R-G525T
Prepreg R-G520T

Normal glass cloth

Laminate R-G525F
Prepreg R-G520F

Halogen-free
  • Application
IC substrate
IC substrate
 

New branding announcement

  • Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.

Properties

Low Stress
CTE x, y-axis
3-5ppm/°C
Tg (DMA)
270°C

IC packages warpage

IC packages warpage

General properties

Item Test method Condition Unit LEXCM GX
R-G525T
Low CTE glass cloth
LEXCM GX
R-G525F
Normal glass cloth
Glass transition temp.(Tg) DMA*2 A °C 270 270
Thermal decomposition temp.(Td) TGA A °C 365 365
CTE x-axis α1 Internal method A ppm/°C 3-5 5-7
CTE y-axis 3-5 5-7
Flexural modulus*1 Warp JIS C 6481 25°C GPa 20 17
Fill 19 16

The sample thickness is 0.1 mm.
*1 0.8mm
*2 Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

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