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R-A555(W)/R-A550(W) : Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series

Product
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series

Series/Type
Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials

Parts no
R-A555(W)/R-A550(W)

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Photo:R-A555(W)/R-A550(W)
Item Performance characteristics
Glass transition temp.(Tg) :DSC (°C) -
Glass transition temp.(Tg) :TMA (°C) 160
Glass transition temp.(Tg) :DMA (°C) 200
Thermal decomposition temp.(Td):TGA (°C) 380
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min) >60
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min) >60
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) 11-13
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) 11-15
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 41
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 270
Thermal conductivity:Laser flash,25˚C (W/m·K) 0.4
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) 1 x 10⁹
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ) 1 x 10⁸
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 -
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 3.4
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 3.2
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 -
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 0.008
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 0.011
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) 0.07
Flexural modulus,Warp/MD:JIS C 6481 (GPa) 26
Flexural modulus,Fill/TD:JIS C 6481 (GPa) 24
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) -
Flammability:UL,C-48/23/50 94V-0
The sample thickness 0.8mm
The above data are typical values and not guaranteed values. -
*1 Test method: TMA -