The reason why an extra-thin gold plated electrode can be used
When a extra-thin gold plated electrode is used, nickel compounds are formed on a surface after the heat treatment by the die-bonding cure. These nickel compounds impair the wire bonding performance, thus it is said that a thin gold plated electrode is unsuitable for wire bonding. However, the argon plasma treatment eliminates the nickel compounds, therefore stable wire bonding can be performed on an extra-thin and extra-cheap gold plated electrode.
Surface reforming by oxygen plasma
Surface reforming by oxygen radical improves mold resin adhesion and under-fill wettability. (Option)
Transfer system options
M type
M type transfer system, loader, and unloader
M type
S type
S type transfer system, loader, and unloader
S type
Model ID PSX307
Model No. NM-EFP1A
Cleaning methed Parallel plate RF back-sputtering method
Gas for electrical discharge *1 Ar [option : O2]
Substrate dimensions (mm) L 50 x W 20 to L 250 x W 75*2 incl. S type option
L 50 x W 20 to L 330 x W 120 incl. M type option
Substrate thickness (mm) 0.5 to 2.0
Dimensions (mm) / Mass*3 W 930 x D 1100 x H 1 450 / 555 kg
W 1 764 x D 1 100 x H 1 450 / 850 kg incl. S type option
W 1 764 x D 1 100 x H 1 450 / 770 kg incl. M type option
Power source*4 1-phase AC 200 V, 2.00 kVA [Full Load 5.00 kVA]
Pneumatic source 0.49 MPa or more, 6.5 L/min [A.N.R.]
*1: If the optional oxygen gas is selected as a discharge gas, nitrogen gas is also required to dilute exhaust.
*2: For W 70.1mm to W 75mm, the electrode in the chamber is required separately.
*3: Tolerance of equipment dimensions is ±5mm, Touch panel and condition lamp is not included. Mass varies depending on configuration.
*4: Compatible with 1-phase 208/220/230/240 V
*Please refer to the specifications on details.