Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding
Die bonding is carried out immediately after Epoxy dispensing, thereby marking it possible to finish the bonding operation before the Epoxy is deteriorated over time.
This realizes stable and high quality bonding at all bond positions on a substrate.
Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die (OP).
This system allows you to realize manufacturing with real-time quality-inspection.

Friendly Operation
The large-sized thouch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Model ID MD-P200
Model No. NM-EFD1B
Productivity *1 0.56 s / IC(Under the fastest conditions)
0.75 s / IC for thermosonic bonding(Including process time of 0.2 seconds. Under the fastest conditions)
Placement accuracy *1 XY(3σ at PFSC conditions):
±7 µm(Flip bonding), ±15 µm(With pre-centering), ±25 µm(Direct bonding)
Substrate dimensions (mm) L 50 x W 30 to L 280 x W 140 (For thermosonic : L 200 mm x W 150 mm)
Die dimensions (mm) L 0.25 x W 0.25 to L 6 x W 6
Number of Die types Up to 12 types(For AWC)/ UP to 10 types(Tray with the palette changer)/
Up to 5 types(Wafer frame with the palette changer)
Configuration of die feeder Wafer frame, Pre-expanded ring, Tray
Adhesive dispenser Air-powered writing, Stamping pin,
Bonding load Pneumatic head : 0.5 N to 10 N(Option : 1 N to 50 N)
VCM head for thermosonic process : 1 N to 50 N (Option : 2 N to 100 N)
Head heating Constant heating, Up to 250℃ for the pneumatic head, Up to 300℃ for the VCM head
Substrate heating Constant heating, Up to 300℃
Number of nozzles Up to 24 nozzles (Pickup nozzle, Bonding nozzle, Stamping tool) (Not available for the thermosonic nozzle)
Power source *2 3-phase AC 200 V ±10V, 50 / 60 Hz, Up to 4 kVA (Up to 7 kVA for heating specification)
Pneumatic source 0.5 MPa, 30 L / min (A.N.R.) (Up to 150 L / min for full-featured machine including cooling air)
Dimensions (mm) Standard specification (Up to 200 mm substrate length. Including loader/unloader)
W 1 950 mm x D 1 190 mm x H 1 720 mm (Machine body : W 1 190 mm x D 1 190 mm x H 1 720 mm)
Mass 2 200 kg (including loader / unloader)

*1:The described productivity and placement accuracy may differ depending on the conditions of use.
*2:Three phase 208 / 220 / 380 / 400 / 415 / 480
For more details, please refer to the specification sheet.