Easy process exchange
Bonding processes are available by switching the bonding tools, which can be done by the customer under the configuration of C4 dipping unit.
Real-time Inspection
The Bonding stage camera enables post-bonding inspection right after the die bonding. (OP)
This system allows you to realize manufacturing with real-time quality-inspection.
Friendly Operation
The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.
| Model ID | MD-P300 |
| Model No. | NM-EFF1C |
| Productivity *1 | C4 : 0.65s/IC (including dipping motion) Thermosonic : 0.65s/IC (including US process time of 0.2s) |
| Placement accuracy *1 | XY (3 at PFSC conditions) : ±5 µm |
| Substrate dimensions (mm) | L 50 × W 50 to L 330 × W 330 (Heating specifications : L 330 × W 220 mm) |
| Die dimensions (mm) | L 1 × W 1 to L 25 × W 25 ( Thermosonic : L7 × W 7) |
| Number of die types | Up to 12 product types (AWC specifications) * 1 nozzle type |
| Die supply | Wafer frame 12 inches (Option : 8 inches) |
| Bonding load | VCM head : 1N to 50 N (Option : 2 N to 100 N) |
| Head heating | Thermosonic : Up to 300℃ |
| Substrate heating *2 | Constant heating, Up to 200℃ (Heating bonding stage specifications : Max. substrate size L 330 × W 220 mm) |
| Power source *3 | 3-phase AC 200V ± 10V, 50/60 Hz, Up to 4 kVA (Up to 7 kVA for heating specification) |
| Pneumatic source | 0.4 Mpa, 50L/min(A.N.R.) (Up to 150 L/min for full-featured machine including cooling air) |
| Dimensions (mm) | W 1 380 × D 1 640 × H 1 430 ( without loader / unloader) |
| Mass | 2 300 kg ( without loader / unloader) |
*1 : The described productivity and placement accuracy may differ depending on the conditions of use.
*2 : Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually.
*3 : 3-phase 208 / 220 / 380 / 400 / 415 / 480
For details, please refer to the specification sheet.
