Easy process exchange
Bonding processes are available by switching the bonding tools, which can be done by the customer under the configuration of C4 dipping unit.
The Bonding stage camera enables post-bonding inspection right after the die bonding. (OP)
This system allows you to realize manufacturing with real-time quality-inspection.
The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.
|Productivity *1||C4 : 0.65s/IC (including dipping motion)
Thermosonic : 0.65s/IC (including US process time of 0.2s)
|Placement accuracy *1||XY (3 at PFSC conditions) : ±5 µm|
|Substrate dimensions (mm)||L 50 × W 50 to L 330 × W 330 (Heating specifications : L 330 × W 220 mm)|
|Die dimensions (mm)||L 1 × W 1 to L 25 × W 25 ( Thermosonic : L7 × W 7)|
|Number of die types||Up to 12 product types (AWC specifications) * 1 nozzle type|
|Die supply||Wafer frame 12 inches (Option : 8 inches)|
|Bonding load||VCM head : 1N to 50 N (Option : 2 N to 100 N)|
|Head heating||Thermosonic : Up to 300℃|
|Substrate heating *2||Constant heating, Up to 200℃ (Heating bonding stage specifications : Max. substrate size L 330 × W 220 mm)|
|Power source *3||3-phase AC 200V ± 10V, 50/60 Hz,
Up to 4 kVA (Up to 7 kVA for heating specification)
|Pneumatic source||0.4 Mpa, 50L/min(A.N.R.)
(Up to 150 L/min for full-featured machine including cooling air)
|Dimensions (mm)||W 1 380 × D 1 640 × H 1 430 ( without loader / unloader)|
|Mass||2 300 kg ( without loader / unloader)|
*1 : The described productivity and placement accuracy may differ depending on the conditions of use.
*2 : Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually.
*3 : 3-phase 208 / 220 / 380 / 400 / 415 / 480
For details, please refer to the specification sheet.