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Various process options available inherited from previous best seller model E620
Process Chamber and Two Types of Plasma Sources
Two Types of Handling System
| Model ID | APX300 | |||||
| Model No. | NM-EFE3AA-S | |||||
| Plasma source | ICP Plasma | |||||
| Process gas | Standard 4 lines (Maximum 6 Lines: Chlorinated Gas, Fluoride Gas, Ar, O2, He, etc.) | |||||
| Wafer size *1 | φ100 mm / 150 mm wafer with orientation flat φ200 mm wafer with notch | |||||
| Dimensions (mm) | [ Load lock wafer Handling ] W 1 350 x D 2 230 x H 2 000 (Exclude touch panel, operation section and signal tower) [ Load lock wafer Handling ] W 1 375 x D 2 600 x H 2 000 (Exclude touch panel, operation section and signal tower) |
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| Mass | 2 000 kg (Differs depending on machine configuration) | |||||
| Power source *2 | 3-phase AC 200 / 208 / 220 / 230 / 240 ±10 V、50 / 60 Hz、21.00 kVA | |||||
| Pneumatic source | 0.5 MPa to 0.7 MPa, 250 L/min (A.N.R.) | |||||
| N2 Source | 0.1 MPa to 0.2 MPa, 50 L/min (A.N.R.) | |||||
*1 : Please consult , if different size of wafer will be required.
*2 : 3-phase electricity has two kinds of lineage. Figure shows total.
*Details should be referred to Spec.
*2 : 3-phase electricity has two kinds of lineage. Figure shows total.
*Details should be referred to Spec.