For secondary mounting reinforcement drop impact resistance liquid encapsulant | CV5313, CV5314

For secondary mounting reinforcement drop impact resistance liquid encapsulant

 

  1. Protection of “brain” of mobile terminal from drop impact
  2. Underfill/Sidefill reinforcement material when BGA/CSP is mounted

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

CV5313 CV5314

  • Application
  • Detailed use
Package
Mobile
・Package
・Mobile
LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC.

Properties

Drop impact resistance
Underfill reinforcement
Sidefill reinforcement

Comparison of impact test evaluations

Comparison of impact test evaluations

Characteristics of main products

Item Unit Underfill
CV5313
Sidefill
CV5314
Viscosity(25°C) Pa⋅s 2 130
Thixotropic index 1.2 3.5
Gel time(150°C) sec 50 70
Recommended curing conditions 120°C 5min 120°C 5min
Tg °C 105 80
α1 ppm 70 35
Flexural modulus GPa 3 7

The above data are typical values and not guaranteed values.

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