- Enhances process reliability by warpage control and high adhesion
→ Low warpage of ultrathin module is achieved - Solder flash during mounting reflow has been reduced, resulting in greatly decreasing the defect ratio
- Large encapsulation area
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV5386 CV5401
- Application
- Detailed use
・Package
・Mobile
・Mobile
Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC.
Properties
Warpage control
High adhesion
Reduced solder flash
Warpage behavior:Shadow moire analysis
Solder flash after mounting reflow has been reduced (X-ray observation)
