PSX307A : Plasma Cleaner

PSX307A

Features

Achieve high quality by plasma cleaning and preforming from wafer process to assembly process

High quality management with plasma monitor

Flexibility for various type of production

Specfication
Model ID PSX307A
Model No. NM-EFP3A
Cleaning Method Parallel plate RF back-sputtering method
Gas for Electrical Discharge *1 Ar [Option:O2, O2 + He]
Substrate dimensions L 50 mm × W 200 mm*2 to L 350 mm × W 350 mm
Substrate thickness 0.1 mm to 2.0 mm
Dimension/Mass *3

W 900 mm × D 1 150 mm × H 1 650 mm

(Excluding touch panel, operating part, and signal tower / 630 kg)

Power source 1-phase AC 200 / 208 / 220 / 230 / 240 ± 10 V, 50 / 60 Hz , 6.00 kVA
Adhesive dispenser 0.49 MPa、25 L/min [A.N.R]

*1 : If the optional oxygen gas(+He) is selected as discharge gas, nitrogen gas is also required to dilute exhaust.
*2 : For the substrate with width < 30mm, please contact us.
*3 : Tolerance of equipment dimension is ± 5mm, touch panel and signal tower is not included. Mass varies depending on configuration.
*Please refer to the specifications on details.