Achieve high quality by plasma cleaning and preforming from wafer process to assembly process
High quality management with plasma monitor
Flexibility for various type of production
|Cleaning Method||Parallel plate RF back-sputtering method|
|Gas for Electrical Discharge *1||Ar [Option:O2, O2 + He]|
|Substrate dimensions||L 50 mm × W 200 mm*2 to L 350 mm × W 350 mm|
|Substrate thickness||0.1 mm to 2.0 mm|
W 900 mm × D 1 150 mm × H 1 650 mm
(Excluding touch panel, operating part, and signal tower / 630 kg)
|Power source||1-phase AC 200 / 208 / 220 / 230 / 240 ± 10 V, 50 / 60 Hz , 6.00 kVA|
|Adhesive dispenser||0.49 MPa、25 L/min [A.N.R]|
*1 : If the optional oxygen gas(+He) is selected as discharge gas, nitrogen gas is also required to dilute exhaust.
*2 : For the substrate with width < 30mm, please contact us.
*3 : Tolerance of equipment dimension is ± 5mm, touch panel and signal tower is not included. Mass varies depending on configuration.
*Please refer to the specifications on details.