Ready for four bonding methods-COG/FOG/FOP/COP
• Covering a wide range of applications from narrow bezel LCD panel to flexible AMOLED panel and future COP bonding
• Exchanging parts supply units allows for exchanging between IC/TCP bonding methods
• Adoption of new type of handling system ready for plastic panels, a warpage correction system and recognition lighting
Actualization of high accuracy bonding
• Inheritance of tried-and-true rigidity pre-bonding head (fixed-point bonding)
• Realization of high accuracy bonding through use of high resolution camera, unique warpage correction system and recognition lighting
High productivity
• Realization of high-speed bonding through use of compact design to minimize systems and reduction in stroke
• Realization of non-stop supply of parts through use of parts supply units (IC/TCP)equipped with the alternate function
Pursuit of high quality
• Use of high rigidity head frame in the final bonding unit to minimize reaction forces under pressure conditions as well as the bonding shift amount at the final bonding unit
• Inheritance of all tried-and-true COG bonding technologies
Line solution
• Realization of improved operation analysis/operation through enhancement of the line control function (CIM)