|Good uniform plasma processing in large area|
Multi Spiral Coil type ICP
• High density plasma without power-loss under low pressure
|Good control of wafer temperature by batch processing system|
Multi wafer direct cooling system
• Good control of wafer temperature by direct chucking wafer
Every single wafer is directly contacted to ESC, even multi-wafer etching in one batch.
Multi-wafer is transferred in a tray and etched at once.
* According to Φ300 mm wafer processing, please consult us separately.
|Various application and abundant etching performance|
GaN : High speed & good uniform etching
* Concerning details of etching data, please inquire us.