Process Units


Solder Inspection (SPI) • Component Inspection (AOI) - Inspection head

Solder Inspection

  • Solder appearance inspection

Mounted component

  • Appearance inspection of mounted components

Pre-mounting foreign
object*1 inspection

  • Pre-mounting foreign object inspection of BGAs
  • Foreign object inspection right before sealed case placement

*1:Foreign object is available to chip components.

automatic switching

  • Solder and component inspection is switched automatically according to production data.

Unification of inspection
and placement data

  • Centrally managed component library or coordinate data does not require two data maintenance of each process.

Automatic link to quality information

  • Automatically linked quality information of each process assists your defect cause analysis.
Adhesive Dispensing - Dispensing head

Screw-type discharge mechanism

  • Panasonic's NPM has the conventional HDF discharge mechanism, which ensures the high-quality dispensing.
  • Supports various dot/drawing dispensing patterns


  • High accuracy sensor (option) measures local PCB height to calibrate dispensing height, which allows for non-contact dispensing on PCB.