Solder Inspection (SPI) • Component Inspection (AOI) - Inspection head Solder Inspection Solder appearance inspection Mounted component Inspection Appearance inspection of mounted components Pre-mounting foreign object*1 inspection Pre-mounting foreign object inspection of BGAs Foreign object inspection right before sealed case placement *1:Foreign object is available to chip components. SPI and AOI automatic switching Solder and component inspection is switched automatically according to production data. Unification of inspection and placement data Centrally managed component library or coordinate data does not require two data maintenance of each process. Automatic link to quality information Automatically linked quality information of each process assists your defect cause analysis. Adhesive Dispensing - Dispensing head Screw-type discharge mechanism Panasonic's NPM has the conventional HDF discharge mechanism, which ensures the high-quality dispensing. Supports various dot/drawing dispensing patterns High accuracy sensor (option) measures local PCB height to calibrate dispensing height, which allows for non-contact dispensing on PCB.