Process units (NPM-D3)


Solder Inspection (SPI) • Component Inspection (AOI) - Inspection head

Solder Inspection

  • Solder appearance inspection

Mounted component Inspection

  • Appearance inspection of mounted components

Pre-mounting foreign object*1 inspection

  • Pre-mounting foreign object inspection of BGAs
  • Foreign object inspection right before sealed case placement

*1: Intended for chip components (except for 03015 mm chip ).


SPI and AOI automatic switching

  • Solder and component inspection is switched automatically according to production data.

Unification of inspection and placement data

  • Centrally managed component library or coordinate data does not require two data maintenance of each process.

Automatic link to quality information

  • Automatically linked quality information of each process assists your defect cause analysis.


Adhesive Dispensing - Dispensing head

Screw-type discharge mechanism

  • Panasonic's NPM has the conventional HDF discharge mechanism, which ensures the high-quality dispensing.

Supports various dot/drawing dispensing patterns

  • High accuracy sensor (option) measures local PCB height to calibrate dispensing height, which allows for non-contact dispensing on PCB.