Low-temperature Curing Secondary Mounting Underfill Material "CV5350AS"

Low-temperature Curing Secondary Mounting Underfill Material " CV5350AS"

  • Cures at a low temp of 80℃.
    After curing, Tg is 140℃ or greater.

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    Achieving the necessary mount reliability
    for automotive parts
  • Smaller difference in heat shrinkage
    with other part, by high Tg

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    Improving electrical connection reliability
    of solder etc.
  • Capillary flow in the narrow gap
    without any voids

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    Possible to capillary flow up to 40 mm
    in the gap of 20μm

Feature (Solution for Customers)

1. Passes temperature cycling test needed for automotive parts.

  • New product
  • Maintains low thermal expansion area due to high Tg.
    Reduces stress by low elasticity and prevents interfacial peeling.
  • Conventional
  • It is difficult for the material with high linear expansion to reduce the stress of parts, peeling off during temperature cycling.
    The low temperature curing / low Tg material has a problem with temperature cycling.
 

2. Compatible with sensors requiring low temperature curing.

  • New product
  • Cures at a low temperature.
  • Conventional
  • Can not be mounted on a sensor that is sensitive to high temperature.

3. A wide range of curing temperature.

  • New product
  • Can be used at various temperatures.
  • Conventional
  • It is necessary to use the underfill material defferently
    at low temperature and high temperature.
Moire data at room temperature

4. Suitable for mounting in areas with small gaps.

  • New product
  • Corresponds to a gap of 20 μm or more with one kind material.
  • Conventional
  • It is necessary to use the underfill material defferently
  • depending on the size of the gap
    between the package and the motherboard.
Cross section of a circuit board being mounted

5. Possible to reinforce partially.

  • New product
  • We also have "Corner reinforce type" suitable for only a part.
  • ※Conventional: Our material CV5313
  • ●We have various other line-up. Please contact us.
Possible to reinforce partially.

Property data

Item Unit          CV5350AS         
Minimum flow gap μm 20
Viscosity (25°C) mPa·s 4000
Glass transition temperature (Tg) °C 150
C.T.E.1 ppm/°C 30
Elastic modulus (25°C) GPa 10
Potential for reworking Not possible

Application

Mount reinforcement of
semiconductor packages and electronic parts for

  • Automotive camera modules
  • Communication modules (millimeter-wave radar modules)
  • ECU (electronic control unit)
Application

Press Release

Contact us