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Flexible Circuit Board Materials for Mobile Products "FELIOS" series : Models

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Datasheet		 Series/Type Glass transition temp.(Tg) :DSC Glass transition temp.(Tg) :TMA(Ad)
(°C) 		Glass transition temp.(Tg) :DMA
Measurement in tensile mode(TPI 240)
(°C) 		Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad)
(°C) 		Thermal decomposition temp.(Td):TGA
(°C) 		Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Test method: Cavity resonance 		Dielectric constant(Dk)@14GHz:Balanced-type circular disk resonator,C-24/23/50 Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Test method: Cavity resonance 		Dissipation factor(Df )@14GHz:Balanced-type circular disk resonator,C-24/23/50 Outgas TML / CVCM / WVR*6,ASTM E595-07,
ASTM E595-15
(%)		 *6 TML：Total Mass Loss, CVCM：Collected Volatile Condensable Material, WVR：Water Vapor Recovered Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 Thermal conductivity:Laser flash,25˚C
(W/m·K)		 Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)		 Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)		 Flexural modulus,Warp/MD:JIS C 6481
(GPa)		 Flexural modulus,Fill/TD:JIS C 6481
(GPa)		 Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))		 Flammability:UL,A+E-168/70 The sample thickness *1 Test method: Internal method *2 Condition: C-96/20/65, Unit : MΩ·m *3 Condition: C-96/20/66 *4 Condition: E-24/50+D-24/23 *5 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
R-F775
 Flexible circuit board materials FELIOS - - 340 - 577 3.2 3.2 3.1 0.002 0.006 0.006 0.62 / 0.05 / 0.55 - - - 18-20 16-19 - - 0.16 - 0.9*1 - - 1.3(7.4)
(ED:18μm)		 94V-0 0.025mm - - - - -
R-F705S
 Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP - - - - 482 - 3.3 2.9 - 0.002 0.002 0.05/＜0.01/0.04
 - - - 17-19 17-19 - - 0.4 - 0.04*1 - - 0.8(4.6)
(ED:18μm)		 94VTM-0 0.05mm - - - - -
R-FR10
 Flexible circuit board materials Resin coated copper foil FELIOS FRCC - 190 - 210 - 3 - - 0.019 - - - - - - 80(Ad) 80(Ad) 80(Ad) 580(Ad) - 1 x 10<sup>8</sup> *2 1.2 *4 - - 0.8(4.6)
(ED:12μm)		 94VTM-0 *5 0.032mm
(Cu:12μm, PI:5μm,Ad:15μm)		 - - - - -
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