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●Inquiry of Irregularities in Third-party Certification
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
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Mass laminations(Shield board) "PreMulti"
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IC Substrate Materials "LEXCM GX" series
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Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
Plastic Molding Compound for LED "FULL BRIGHT" series
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Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
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Multifunctional Shock Absorber
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IC Substrate Materials "LEXCM GX" series
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Flexible Circuit Board Materials for Mobile Products "FELIOS" series : Models
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R-F700S (LCP* Single-sided copper clad) (9)
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ED (73)
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BHY (29)
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190 (1)
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Measurement in tensile mode(Ad) (°C)
210 (1)
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80(Ad) (1)
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80(Ad) (1)
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580(Ad) (1)
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Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)
1 x 10<sup>8</sup> *2 (1)
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Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
3 (1)
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Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
0.019 (1)
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Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)
1.2 *4 (1)
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Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))
0.8(4.6)
(ED:12μm) (1)
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Flammability:UL,A+E-168/70
94VTM-0 *5 (1)
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The sample thickness
0.032mm
(Cu:12μm, PI:5μm,Ad:15μm) (1)
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*1 Condition: C-96/20/65, Unit : MΩ·m
- (121)
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*2 Condition: E-24/50+D-24/23
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*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
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Peel Strength.90°:JIS C 6471.A (mm)
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0.65 (3)
0.75 (14)
0.8 (8)
0.9 (1)
1 (15)
1.1 (1)
1.2 (2)
1.3 (12)
1.5 (24)
1.6 (9)
1.7 (4)
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2 (4)
2.2 (1)
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2.5 (10)
2.6 (2)
3 (4)
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Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm)
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0.65 (3)
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1 (15)
1.1 (1)
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3 (4)
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-0.055 (1)
-0.048 (1)
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-0.007 (2)
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-0.004 (4)
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0 (1)
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0.001 (1)
0.002 (1)
0.003 (1)
0.004 (1)
0.0047 (1)
0.005 (1)
0.0059 (1)
0.006 (2)
0.007 (3)
0.008 (2)
0.0086 (1)
0.009 (3)
0.0102 (1)
0.011 (1)
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0.03 (1)
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0.033 (1)
0.036 (1)
0.04 (1)
0.0424 (1)
0.0436 (1)
0.0463 (1)
0.058 (1)
0.064 (2)
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Dimensional Stability.TD:IPC-TM-650.After Etching (%)
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-0.058 (1)
-0.053 (1)
-0.049 (1)
-0.039 (1)
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0.001 (3)
0.0012 (1)
0.002 (2)
0.003 (1)
0.004 (2)
0.006 (1)
0.0069 (1)
0.0076 (1)
0.008 (1)
0.009 (3)
0.01 (3)
0.0102 (1)
0.012 (2)
0.0122 (1)
0.013 (1)
0.0156 (1)
0.0167 (1)
0.017 (3)
0.0171 (1)
0.0175 (1)
0.018 (1)
0.02 (4)
0.0209 (1)
0.021 (1)
0.022 (1)
0.0228 (1)
0.023 (1)
0.024 (1)
0.0247 (1)
0.025 (2)
0.0258 (1)
0.027 (2)
0.028 (1)
0.0285 (1)
0.0286 (1)
0.029 (1)
0.0297 (1)
0.032 (1)
0.033 (1)
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0.059 (1)
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0.0599 (1)
0.06 (1)
0.068 (1)
0.0739 (1)
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Dimensional Stability.MD:IPC-TM-650.E-0.5/150 (%)
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-0.082 (1)
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0.0012 (1)
0.005 (1)
0.0052 (1)
0.007 (1)
0.0072 (1)
0.0074 (1)
0.0082 (2)
0.0086 (1)
0.009 (4)
0.0092 (1)
0.0116 (1)
0.0146 (1)
0.0169 (1)
0.019 (1)
0.0242 (1)
0.025 (1)
0.028 (1)
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0.05 (1)
0.054 (1)
0.06 (1)
0.067 (2)
0.07 (1)
0.0717 (1)
0.072 (1)
0.077 (1)
0.082 (1)
0.0821 (1)
0.088 (1)
0.089 (1)
0.092 (1)
0.0973 (1)
0.0996 (1)
0.108 (1)
0.121 (1)
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Dimensional Stability.TD:IPC-TM-650.E-0.5/150 (%)
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-0.28 (1)
-0.0807 (1)
-0.073 (1)
-0.0684 (1)
-0.066 (1)
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-0.0438 (1)
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-0.037 (3)
-0.035 (2)
-0.0345 (1)
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-0.0215 (1)
-0.021 (1)
-0.0193 (1)
-0.019 (1)
-0.017 (1)
-0.0165 (1)
-0.0158 (1)
-0.015 (1)
-0.011 (2)
-0.01 (1)
-0.009 (2)
-0.0084 (1)
-0.008 (2)
-0.007 (1)
-0.003 (1)
-0.002 (1)
-0.001 (1)
0.001 (3)
0.002 (1)
0.0021 (1)
0.0026 (1)
0.003 (1)
0.004 (1)
0.0064 (1)
0.007 (1)
0.0072 (1)
0.008 (1)
0.0088 (1)
0.009 (2)
0.011 (1)
0.013 (2)
0.015 (1)
0.017 (1)
0.021 (1)
0.025 (1)
0.0274 (1)
0.028 (1)
0.0298 (1)
0.031 (1)
0.035 (1)
0.036 (1)
0.0375 (1)
0.04 (1)
0.0413 (1)
0.044 (1)
0.0464 (1)
0.048 (1)
0.053 (1)
0.054 (1)
0.0546 (1)
0.0562 (1)
0.0582 (1)
0.059 (1)
0.0597 (1)
0.064 (1)
0.0713 (1)
0.073 (1)
0.0762 (1)
0.0765 (1)
0.078 (1)
0.094 (1)
- (3)
Reset
Soldering Resistance:JIS C 6471.A (°C)
-
310 (25)
330 (94)
340 (1)
- (1)
Reset
Soldering Resistance:JIS C 6471.C-96/40/90 (°C)
-
250 (38)
260 (56)
270 (1)
290 (25)
- (1)
Reset
MIT Test:JIS C 6471.0.38R×4.9N,MD
-
3 (3)
4 (3)
5 (1)
6 (1)
7 (1)
8 (1)
9 (3)
10 (5)
11 (1)
12 (2)
13 (1)
14 (1)
15 (2)
16 (4)
18 (1)
19 (2)
20 (5)
22 (2)
24 (1)
26 (2)
28 (2)
30 (1)
32 (1)
33 (1)
34 (1)
35 (4)
40 (6)
42 (1)
45 (1)
46 (1)
60 (3)
70 (1)
84 (1)
85 (1)
90 (1)
100 (1)
110 (2)
118 (1)
120 (2)
130 (1)
170 (4)
180 (2)
200 (1)
220 (2)
230 (1)
255 (1)
270 (2)
280 (1)
300 (1)
340 (2)
530 (1)
- (28)
Reset
MIT Test:JIS C 6471.0.38R×4.9N,TD
-
3 (3)
4 (3)
6 (1)
7 (2)
8 (3)
9 (1)
10 (5)
12 (4)
13 (1)
15 (6)
16 (2)
18 (3)
20 (4)
25 (1)
26 (3)
28 (2)
30 (1)
31 (1)
33 (1)
35 (2)
39 (1)
40 (9)
50 (1)
54 (1)
60 (4)
61 (1)
70 (1)
83 (1)
94 (1)
100 (2)
110 (1)
120 (2)
130 (1)
160 (2)
170 (3)
190 (1)
200 (1)
220 (2)
230 (1)
250 (1)
260 (1)
280 (1)
290 (2)
340 (2)
550 (1)
- (28)
Reset
Tensile Modulus:IPC-TM-650 (GPa)
-
4.5 (25)
7.1 (95)
- (1)
Reset
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
18 (25)
19.3 (95)
- (1)
Reset
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
17.3 (95)
18 (25)
- (1)
Reset
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
Reset
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
Reset
Dielectric Constant at 10GHz:Cavity resonance.A
3.3 (25)
- (96)
Reset
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
Reset
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
Reset
Dissipation Factor at 10GHz:Cavity resonance.A
0.002 (25)
- (96)
Reset
Insulation resistance:JIS C 6471.A (Ω)
>1.0×10^14 (120)
- (1)
Reset
Insulation resistance:JIS C 6471.C-96/40/90 (Ω)
>1.0×10^14 (120)
- (1)
Reset
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%)
0.8 (95)
- (26)
Reset
Water absorption:JIS C 6471.D-24/23 (%)
0.04 (25)
- (96)
Reset
Moisture Absorption.IPC-TM-650:C-24/23/50 (%)
0.7 (95)
- (26)
Reset
Tg:DMA.A (°C)
350 (95)
- (26)
Reset
Flammability:UL 94.A+E-168/70
V-0 (79)
VTM-0 (41)
- (1)
Reset
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
- (121)
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Display items
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
Fiim Thickness
Total products thickness
Peel Strength.90°:JIS C 6471.A
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
Dimensional Stability.MD:IPC-TM-650.After Etching
Dimensional Stability.TD:IPC-TM-650.After Etching
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
Soldering Resistance:JIS C 6471.A
Soldering Resistance:JIS C 6471.C-96/40/90
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃, 5℃/min
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃, 5℃/min
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
Insulation resistance:JIS C 6471.C-96/40/90
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
Water absorption:JIS C 6471.D-24/23
Moisture Absorption.IPC-TM-650:C-24/23/50
Tg:DMA.A
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance. The test method of above item is determined according to Panasonic internal standard.
Select display items by click or drag-and-drop
Glass transition temp.(Tg) :TMA(Ad)
Glass transition temp.(Tg) :DMA Measurement in tensile mode(Ad)
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
Choice
Parts no
Catalog /
Datasheet
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
(µm)
Fiim Thickness
(µm)
Total products thickness
(µm)
Peel Strength.90°:JIS C 6471.A
(mm)
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
(mm)
Dimensional Stability.MD:IPC-TM-650.After Etching
(%)
Dimensional Stability.TD:IPC-TM-650.After Etching
(%)
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
(%)
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
(%)
Soldering Resistance:JIS C 6471.A
(°C)
Soldering Resistance:JIS C 6471.C-96/40/90
(°C)
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
(GPa)
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
(Ω)
Insulation resistance:JIS C 6471.C-96/40/90
(Ω)
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
(%)
Water absorption:JIS C 6471.D-24/23
(%)
Moisture Absorption.IPC-TM-650:C-24/23/50
(%)
Tg:DMA.A
(°C)
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
Glass transition temp.(Tg) :TMA(Ad)
(°C)
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad)
(°C)
CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)
Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
R-F775_42RB_18-100-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
100
136
2.2
2.2
0.004
0.003
-0.04
-0.28
330
250
10
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_27RN_105-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
105
50
155
3
3
-0.0154
-0.0278
-0.0621
-0.0807
330
260
24
28
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_23EC_12-50-12(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
12
50
74
0.75
0.75
-0.004
-0.058
-0.002
-0.073
310
290
85
70
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A0RB_70-125-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
125
265
2.5
2.5
-0.0192
-0.0299
-0.0548
-0.0684
330
250
9
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_B1RB_35-150-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
150
220
1.6
1.6
-0.048
-0.035
-0.081
-0.066
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_41EM_35-100-35(ED)
R-F775 (Double-sided copper clad)
ED
T4M-HDR
35
10
170
3
3
-0.0151
-0.0249
-0.0447
-0.064
330
250
12
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_27RN_105-50-105(RA
R-F775 (Double-sided copper clad)
RA
BHY-HA-V2
105
50
260
3
3
-0.0106
-0.027
-0.0518
-0.062
330
250
26
26
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_B2RB_18-150-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
150
186
1.6
1.6
-0.023
-0.025
-0.081
-0.062
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_31EM_35-75-35(ED)
R-F775 (Double-sided copper clad)
ED
T4M-HDR
35
70
145
2.5
2.5
-0.034
-0.025
-0.067
-0.058
330
250
20
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_12RB_18-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
25
43
1.5
1.5
-0.014
-0.013
-0.055
-0.057
330
260
180
200
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_40RB_70-100-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
100
240
2.5
2.5
-0.0457
-0.0254
-0.0774
-0.0567
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_24EC_9-50-9(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
9
50
68
0.8
0.8
0.007
-0.053
0.04
-0.056
310
290
60
50
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_11RB_35-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
35
25
60
1.6
1.6
0.006
-0.007
-0.036
-0.056
330
260
90
130
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_41EM_35-100-0(ED)
R-F770 (Single-sided copper clad)
ED
T4M-HDR
35
100
135
3
3
-0.0218
-0.0222
-0.056
-0.0556
330
250
12
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A1RB_35-125-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
125
195
1.6
1.6
-0.033
-0.023
-0.059
-0.053
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_43EC_12-100-12(ED
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
12
100
124
0.75
0.75
-0.016
-0.049
0.009
-0.052
310
290
11
8
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_11EM_35-25-35(ED)
R-F775 (Double-sided copper clad)
ED
T4M-HDR
35
25
95
1.8
1.8
-0.007
-0.001
-0.051
-0.051
330
260
110
100
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_2PEL_2-50-2(ED)
R-F775 (Double-sided copper clad)
ED
MT18FL
2
50
54
1.3
1.3
-0.02
-0.006
-0.058
-0.05
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_22RB_18-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
50
68
1.5
1.5
-0.004
-0.01
-0.047
-0.046
330
260
60
60
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_20RB_70-50-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
50
190
1.1
1.1
-0.044
-0.011
-0.082
-0.046
330
260
26
26
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_30RB_70-75-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
70
75
145
2.5
2.5
-0.0185
-0.00050
-0.0688
-0.0459
330
250
19
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A2RB_18-125-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
125
161
2
2
-0.015
-0.012
-0.076
-0.044
330
250
9
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_21RB_35-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
35
50
85
2.5
2.5
0.009
0.013
-0.0175
-0.0438
330
260
42
54
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_13EC_12-25-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
25
37
0.75
0.75
0.036
0.01
0.082
-0.041
310
290
300
280
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A3EV_12-125-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
125
149
1.5
1.5
-0.0163
-0.0141
-0.04
-0.0401
330
250
5
7
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_B4EV_9-150-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
9
150
159
1.7
1.7
0
-0.0047
-0.0376
-0.0394
330
250
4
4
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_23EC_12-50-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
50
62
0.75
0.75
0.04
-0.039
0.089
-0.039
310
290
84
61
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_3PEL_2-75-2(ED)
R-F775 (Double-sided copper clad)
ED
MT18FL
2
75
79
1.3
1.3
-0.0132
-0.0057
-0.0507
-0.0383
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_42EV_18-100-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
100
118
2.6
2.6
-0.0088
-0.0085
-0.0381
-0.038
330
250
7
9
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_B2RB_18-150-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
150
168
2
2
0.015
0.004
-0.016
-0.037
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_41RB_35-100-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
100
170
2.5
2.5
-0.01
-0.005
-0.039
-0.037
330
250
15
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_42EV_18-100-18(ED)
R-F775 (Double-sided copper clad)
ED
VLP
18
100
136
2.6
2.6
-0.011
-0.014
-0.029
-0.037
330
250
10
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_22EC_18-50-18(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
18
50
86
0.8
0.8
0.016
-0.038
0.05
-0.035
310
290
110
100
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_33EV_12-75-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
75
99
1.5
1.5
-0.038
-0.005
-0.083
-0.035
330
250
16
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_16ES_6-25-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
25
31
1
1
-0.0258
-0.0103
-0.0579
-0.0345
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_33EV_12-75-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
75
87
1.5
1.5
-0.003
-0.0015
-0.0333
-0.0337
330
250
16
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_32EV_18-75-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
75
73
1.5
1.5
-0.008
-0.0058
-0.0304
-0.0328
330
250
15
18
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_43EV_12-100-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
100
112
2.4
2.4
-0.012
-0.014
-0.029
-0.03
330
250
10
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_43EV_12-100-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
100
124
2.4
2.4
-0.012
-0.014
-0.029
-0.03
330
250
10
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_30RB_70-75-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
75
215
2.5
2.5
-0.0269
-0.0019
-0.0542
-0.0296
330
250
18
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_34EV_9-75-9(ED)
R-F775 (Double-sided copper clad)
ED
VLP
9
75
93
1.5
1.5
-0.007
0.0012
-0.0343
-0.0293
330
250
35
39
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_43EC_12-100-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
100
112
0.75
0.75
-0.018
-0.036
0.009
-0.029
310
290
10
8
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_A2RB_18-125-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
125
143
2
2
0.02
-0.004
-0.022
-0.029
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_10RB_70-25-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
25
165
2.5
2.5
-0.055
-0.008
-0.105
-0.028
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_11RB_35-25-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
25
95
1.6
1.6
-0.019
0.001
-0.045
-0.027
330
260
270
220
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_24RS_9-50-9(RA)
R-F775 (Double-sided copper clad)
RA
BHYA-HS
9
50
68
1.2
1.2
-0.01
0.002
-0.036
-0.026
330
260
30
16
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_43RX_12-100-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
100
112
1.5
1.5
0.0047
0.0076
-0.0281
-0.0259
330
250
13
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_14RN_9-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY-HA-V2
9
25
34
1.3
1.3
-0.0127
-0.0022
-0.0425
-0.0255
330
260
340
340
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_42RB_18-100-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
100
118
2
2
-0.006
-0.0063
-0.0283
-0.0251
330
250
14
13
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_33RX_12-75-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
75
87
1.5
1.5
0.0102
0.0175
-0.0334
-0.0242
330
250
22
33
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-