Zoom [Equipment] and [Process] achieving wafer high-precision processing, high-quality bonding of bare IC chips, etc. And associated [Material] and [Software] Equipment to bond bare chips on substrates or leadframes Equipment to clear surfaces by the molecule level utilizing plasma Equipment to clear surfaces by the molecule level utilizing plasma Equipment to bond bare chips with bumps on electrodes Equipment to carry out micro fabrication of the circuit of a semiconductor or an electron device circuits
