For power modules high thermal conductive semiconductor encapsulation materials | CV4180, CV4380

For power modules high thermal conductive semiconductor encapsulation materials

 

  1. Achieving high mountability and high heat dissipation → Package warpage control
  2. Suitable for large packages with heat spreaders exposed → T/C resistance improvement due to stress reduction
  3. Compatible with nickel plating → Achieved high adhesion

Semiconductor Encapsulation Materials

  •  Part Number 

CV4180 CV4380

  • Application
  • Detailed use
Package
Automotive
・Package
・Automotive
Automotive module, Inverter module for major appliances and industrial motors

Properties

High heat dissipation
Stress reduction
High adhesion

EMC (Epoxy Molding Compound) explainer video

Stress reduction:Thermal cycle(T/C) resistance

Stress reduction:Thermal cycle(T/C) resistance

Nickel plating adhesion:Shear adhesive strength

Nickel plating adhesion:Shear adhesive strength

Line-up

Part Number Applications Features
CV3300 / CV4380 Encapsulation of fully-molded module High thermal conductive grade(1.7∼2.3 W/mK)
CV4500 / CV4580 Super high thermal conductive grade(3.0∼3.5 W/mK)
CV4100A/CV4180A Encapsulation of module with heat spreader exposed Low stress type for metallic substrates
CV4100B/CV4180B Low stress type for ceramic substrates