Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series : Models

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Series/Type Glass transition temp.(Tg) :DSC
(°C)
Glass transition temp.(Tg) :TMA
(°C)
Glass transition temp.(Tg) :DMA
(°C)
Thermal decomposition temp.(Td):TGA
(°C)
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
(min)
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
(min)
CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
Thermal conductivity:Laser flash,25˚C
(W/m·K)
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ)
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 Dielectric constant(Dk)@14GHz:Balanced-type circular disk resonator,C-24/23/50 Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 Dissipation factor(Df)@14GHz:Balanced-type circular disk resonator,C-24/23/50 Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)
Flexural modulus,Warp/MD:JIS C 6481
(GPa)
Flexural modulus,Fill/TD:JIS C 6481
(GPa)
Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
Peel Strength,1oz(H-VLP3):IPC-TM-650 2.4.8
(kN/m)
Flammability:UL,C-48/23/50 The sample thickness The above data are typical values and not guaranteed values. *1 Test method: TMA
R-1755V
HIPER V
Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type>
173 165 190 350 >120 20 11-13 13-15 44 255 0.53 1 x 10⁹ 1 x 10⁸ 4.4 - 4.3 - 0.016 0.02 - - 0.12 24 22 1.5(8.6) - 94V-0 0.8mm - -
R-5725/R-5620
MEGTRON4S, MEGTRON4
Low transmission loss Highly heat resistant Multi-layer circuit board materials
176 170 210 360 >120 30 12-14 13-15 35 265 0.6 1 x 10⁹ 1 x 10⁸ 3.8 - 3.8 - 0.005 0.007 - - 0.14 25 23 1.1(6.3)
(Cu:RT)
- 94V-0 0.8mm - -
R-5725S/5620S
MEGTRON4S, MEGTRON4
Low transmission loss Highly heat resistant Multi-layer circuit board materials
200 190 215 360 >120 50 12-14 13-15 32 250 0.6 1 x 10⁹ 1 x 10⁸ 3.8 - 3.8 - 0.005 0.007 - - 0.14 25 23 1.3(7.4)
(Cu:RT)
- 94V-0 0.8mm - -
R-5795(N)
MEGTRON8 series
Ultra low transmission loss, highly heat-resistant multi layer circuit board materials
- - 220 370 - >60 17-20 17-20 50 270 - - - - - - 3.13 - - - 0.0016 0.06 - - - 0.7 94V-0 0.75mm - -
R-5795(U)
MEGTRON8 series
Ultra low transmission loss, highly heat-resistant multi layer circuit board materials
- - 220 370 - >60 17-20 17-20 50 270 - - - - - - 3.08 - - - 0.0012 0.06 - - - 0.7 94V-0 0.75mm - -
R-1577/R-1570
MEGTRON2, MEGTRON2E
Halogen-free Low transmission loss Highly heat resistant Multi-layer circuit board materials
170 165 190 380 >120 25 14-16 14-16 34 200 0.5 1 x 10⁹ 1 x 10⁸ 4.1 - 4 - 0.01 0.013 - - 0.14 25 23 1.3(7.4) - 94V-0 0.8mm - -
R-1577E/R-1570E
MEGTRON2, MEGTRON2E
Halogen-free Low transmission loss Highly heat resistant Multi-layer circuit board materials
173 170 190 385 >120 25 14-16 14-16 35 210 0.5 - - 4.2 - 4.1 - 0.01 0.013 - - - 25 23 1.3(7.4) - 94V-0 0.8mm - -
R-5785(GE)/R-5680(GE)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
200 - 210 400 >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 3.6 - 3.6 - 0.002 - 0.003 - 0.06 20 19 0.8(4.6)
(Cu:H-VLP2)
- 94V-0 0.75mm - -
R-5785(GN)/R-5680(GN)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
200 190 210 400 >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 3.4 - 3.4 - 0.001 - 0.002 - 0.06 19 18 0.8(4.6)
(Cu:H-VLP2)
- 94V-0 0.75mm - -
R-5785(GN)/R-5681(GN)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
200 190 210 400 >120 >120 - - - - - - - - - - - - - - - - - - - - - - - -
R-5785(N)/R-5680(N)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
200 - 210 400 >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 3.4 - 3.4 - 0.001 - 0.002 - 0.06 19 18 0.8(4.6)
(Cu:H-VLP)
- 94V-0 0.75mm - -
R-5775(G)/R-5670(G)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
185 - 210 410 >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 3.7 - 3.6 - 0.002 - 0.004 - 0.14 20 19 0.8(4.6)
(Cu:H-VLP)
- 94V-0 0.75mm - -
R-5775(K)/R-5670(K)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
185 - 210 410 >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 3.7 - 3.6 - 0.002 - 0.004 - 0.14 20 19 0.8(4.6)
(Cu:H-VLP)
- 94V-0 0.75mm - -
R-5775(N)/R-5670(N)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
185 - 210 410 >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 3.4 - 3.4 - 0.002 - 0.004 - 0.14 19 18 0.8(4.6)
(Cu:H-VLP)
- 94V-0 0.75mm - -
R-5375(E)/R-5370(E)
Halogen-free MEGTRON6 series
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials,
- 210 250 435 >120 >120 14-16 14-16 39 200 0.37 1 x 10⁹ 1 x 10⁸ 3.7 - 3.7 - 0.002 - 0.002 - 0.22 19 18 0.6(3.4)
(Cu:H-VLP2)
- 94V-0
equivalent
0.75mm - -
R-5375(N)/R-5370(N)
Halogen-free MEGTRON6 series
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials,
- 210 250 435 >120 >120 14-16 14-16 39 200 0.37 1 x 10⁹ 1 x 10⁸ 3.4 - 3.4 - 0.001 - 0.001 - 0.23 20 19 0.6(3.4)
(Cu:H-VLP2)
- 94V-0
equivalent
0.75mm - -
R-5735/R-5630
MEGTRON M
Low transmission loss Highly heat resistant Multi-layer circuit board materials
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5775(R)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5775(S)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5785(R)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -