- Excellent low warpage at large-sized package by low CTE property.
- Good for high performance computing application.
Circuit Board Materials
- Part Number
Low CTE glass cloth
Laminate R-G535S
Normal glass cloth
Laminate R-G535E
- Application
- Detailed use
・Package
IC substrate(FC-BGA)
New branding announcement
- Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Properties
CTE x, y-axis
4-6ppm/°C
4-6ppm/°C
Low Package Warpage
(FC-BGA)
(FC-BGA)
Good MTH Processability
(Mechanical Through Hole)
(Mechanical Through Hole)
IC Package Warpage
Mechanical drilling processability
General properties
| Item | Test method | Condition | Unit | LEXCM GX R-G535S Low CTE glass cloth |
LEXCM GX R-G535E Normal glass cloth |
|
|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DMA* | A | °C | 250-260 | 250-260 | |
| CTE x-axis | α1 | IPC-TM-650 2.4.41 | A | ppm/°C | 4-6 | 7-8 |
| CTE y-axis | 4-6 | 7-8 | ||||
| Dielectric constant(Dk) | 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 4.4 | 4.6 |
| Dissipation factor(Df) | 0.015 | 0.015 | ||||
| Flexural modulus | JIS C 6481 | 20°C | GPa | 32-34 | 28-30 | |
The sample thickness is 0.8mm.
* 0.4mm Measurement in tensile mode
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
