Achieving the high weld strength.
Ideal for the molding of very small precision parts. (Thin-wall molding)
Achieving high fluidity and heat resistance at narrow gate.
Plastic Molding Compound
For mobile products
Connector, Electronic components
Achieving high fluidity and heat resistance at narrow gate
Measurement of (maximum) tensile strength of portion having weld line
Warpage reduction comparison
|Evaluation using test piece having connector shape||For narrow-pitch connector||Wide use connector|
|Weld strength||High strength||Conventional LCP|
|Bending strength||Molding compound A||N||22||23||18|
|Amount of bending deflection||Molding compound A||mm||0.80||0.75||0.43|
|Flexural modulus||Molding compound A||GPa||15||18||20|
|Tensile strength of the welding part||Molding compound A||N||36||34||17|
|Warpage||Molding compound B||mm||0.068||0.071||0.130|
(After 270°C reflow×3times)
|Molding compound B||mm||0.075||0.082||0.143|
|Fluidity(Injection flow)||Molding compound B||mm||52||55||45|
The above data is actual values and not guaranteed values.