R-F775 : Flexible Circuit Board Materials for Mobile Products "FELIOS" series

Product
Flexible Circuit Board Materials for Mobile Products "FELIOS" series

Series/Type
Flexible circuit board materials FELIOS

Parts no
R-F775

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Photo:R-F775
Item Performance characteristics
Glass transition temp.(Tg) :DSC -
Glass transition temp.(Tg) :TMA(Ad) (°C) -
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(TPI 240) (°C)
340
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad) (°C)
-
Thermal decomposition temp.(Td):TGA (°C) 577
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 -
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 -
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) 18-20
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) 16-19
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) -
Thermal conductivity:Laser flash,25˚C (W/m·K) 0.16
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) -
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) 3.2
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Test method: Cavity resonance
3.2
Dielectric constant(Dk)@14GHz:Balanced-type circular disk resonator,C-24/23/50 3.1
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) 0.002
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Test method: Cavity resonance
0.006
Dissipation factor(Df )@14GHz:Balanced-type circular disk resonator,C-24/23/50 0.006
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) 0.9*1
Flexural modulus,Warp/MD:JIS C 6481 (GPa) -
Flexural modulus,Fill/TD:JIS C 6481 (GPa) -
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) 1.3(7.4)
(ED:18μm)
Flammability:UL,C-48/23/50 94V-0
The sample thickness 0.025mm
*1 Test method: Internal method -
*2 Condition: C-96/20/65, Unit : MΩ·m -
*3 Condition: C-96/20/66 -
*4 Condition: E-24/50+D-24/23 -
*5 Measured by R-FR10/R-F775 25μm/ R-FR10 construction -