Ready for four bonding methods-COG/FOG/FOP/COP
Covering a wide range of applications from narrow bezel LCD panel to flexible AMOLED panel and future COP bonding
Exchanging parts supply units allows for exchanging between IC/TCP bonding methods
Adoption of new type of handling system ready for plastic panels, a warpage correction system and recognition lighting
Actualization of high accuracy bonding
Inheritance of tried-and-true rigidity pre-bonding head (fixed-point bonding)
Realization of high accuracy bonding through use of high resolution camera, unique warpage correction system and recognition lighting
High productivity
Realization of high-speed bonding through use of compact design to minimize systems and reduction in stroke
Realization of non-stop supply of parts through use of parts supply units (IC/TCP)equipped with the alternate function
Pursuit of high quality
Use of high rigidity head frame in the final bonding unit to minimize reaction forces under pressure conditions as well as the bonding shift amount at the final bonding unit
Inheritance of all tried-and-true COG bonding technologies
Line solution
Realization of improved operation analysis/operation through enhancement of the line control function (CIM)
| Model ID | FPX007CG/FP | |||
| Model No. | NM-EFL1SC (Normal Flow:Left to Right) | |||
| Panel Size (mm) | L 25 × W 30 to L 130 × W 190(equal to 1- to 8-inch) The shorter side: the bonding side LCD panel : panel thickness : 0.3 to 1.1 Total panel thickness: 0.6 to 2.5 AMOLED panel : panel thickness : 0.05 to 1.0 Total panel thickness:0.05 to 2.0 |
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| Cycle Time*1 | COG bonding : 2.8s/panel (Final bonding time : 5s) FOP bonding : 3.5s/panel (Final bonding time : 5s) |
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| Final Bonding Accuracy*2 | COG bonding : XY : ±3μm/3σ after final bonding FOP bonding : XY : ±4μm/3σ after final bonding |
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| ACF Size (mm) | Width 0.8 to 2.0 Reel diameter : Max.φ230 | |||
| IC Size (mm) | L 7 × W 0.7 × T 0.3 to L 35 × W 1.5 × T 1.0 | |||
| TCP Size (mm) | L 14 × W 20 × T 0.04 to L 64 × W 50 × T 0.1 | |||
| Press Specification | Process | ACF attachment | Pre-bonding | Final bonding |
| Temperature*3 | 40 to 150 ℃ | 40 to 120 ℃ | 40 to 400℃ (Backup stage:40 to 150℃) |
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| Pressure | 20 to 160 N | 10 to 50 N | 30 to 1000 N | |
| Power Source | 3-phase AC 200 / 220 / 380 / 400 V,50 / 60 Hz, 6.0 kVA | |||
| Pneumatic Source |
0.45 MPa Main unit:400 L/min (A.N.R.) Supply unit (TCP supply unit only) : 200 L/min (A.N.R.) |
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| Vacuum Source | -0.08 Mpa × 2 lines, 240 L/min(Total suction flow rate) | |||
| Dimensions (mm)*4 | With IC supply unit : W 3 312 × D 1 600 × H 1 600*5 (IC supply unit included) With TCP supply unit : W 3 312 × D 2 040 × H 1 800*5 (TCP supply unit included) |
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| Mass*4 | 2 700 kg IC supply unit : 300 kg TCP supply unit : 700 kg |
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* The value of cycle time or bonding accuracy as an example may vary depending on the conditions such as the process.
*1 : When 1 TCP is bonded per side and 2 panels are simultaneously transported. Varies depending on operating conditions such as process etc.
*2 : Based on our work-piece(Bonding length:25mm) specially designed for evaluation.
*3 : Tool surface temperature
*4 : Varies depending on the optional configuration
*5 : Excluding the signal tower