- Inhibiting solder joint failure and improving assembly-level reliability for automotive quality by temperature resistance and low CTE.
- With a pot life of 72 hours under ambient conditions, offering improved handling performance which means higher productivity during surface mount assembly.
- Improving the reliability of large surface mount package, as well as BGAs larger than 25 mm × 25 mm. Also be used for Cornerbond and Edgebond.
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV5797 series
- Application
- Detailed use
・Package
・Automotive
・Automotive
Surface mounting PKG: CSP, BGA, WLCSP, QFN, MLCC, Image sensor, etc.
Press Release
Properties
For large size PKG
Glass transition temp. (Tg)
160°C
160°C
Pot life: 72h
Surface Mount Assembly Reinforcement Type for PKGs
Product Introduction Video
Other video
ASYMTEK introduced the surface mount assembly reinforcement with a Jet Dispenser using Panasonic sidefill materials.
>>> Click to watch Sidefill Jetting video
Passing the temperature cycle test in harsh environments like automotive applications
General properties
| Item | Unit | CV5797U |
|---|---|---|
| Glass transition temperature (Tg) | °C | 160 |
| CTE | ppm/°C | 14 |
| Storage condition | - | -20°C / 6 months |
| Pot life | hours | 72 |
The written property values are just an example of our product line-up. Please contact us for details.
