- Cures at low temperatures and can be applied for mount-reinforcement of precision parts that need to be protected from higt temperatures.
- Improves the mounting reliability of automotive parts, for which high bonding strength is required.
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV5350AS
- Application
- Detailed use
・Automotive
・Package
・Package
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc.
Properties
Cures at a low temp of 80°C
After curing,Tg is 140°C or greater
After curing,Tg is 140°C or greater
Smaller difference in heat
shrinkage with other part,by highTg
shrinkage with other part,by highTg
Possible to capillary flow up
to 40mm in the gap of 20μm
to 40mm in the gap of 20μm
Moire data at Room temperature
Suitable for mounting in areas with small gaps
Correspond to temperature cycle test under Automotive environment
General properties
| Item | Unit | CV5350AS |
| Minimum flow gap | µm | 20 |
| Viscosity (25°C) | mPa·s | 4000 |
| Glass transition temperature (Tg) | °C | 150 |
| C.T.E.1 | ppm/°C | 30 |
| Elastic modulus (25°C) | GPa | 10 |
| Potential for reworking | - | Not possible |
The written property values are just an example of our product line-up. Please contact us for details.
