- Available in forms of granule, liquid, and sheet, according to the required encapsulation thickness and size, enabling compression molding and lamination molding.
- Respond to growing size and low warpage of thin packages and contribute to the increased productivity of advanced semiconductor packages.
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV8511C (EMC)
CV2308 (Sheet)
CV5788 (Liquid)
- Application
- Detailed use
・Package
・Mobile
・Mobile
Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices.
Topics
Properties
Low stress
Low shrinkage
Low temp.curability
FOWLP Technology Trend
Each material and corresponding package
Encapsulation method
General properties
| Item | Unit | CV8511C | CV2308 | CV5788 |
| Mold Size | - |
Wafer Level/Panel Level
|
||
| Molding | - |
Compression |
Compression/Laminate | Compression |
| Process | - |
Chip First/Chip Last |
||
| Form | - |
Granule
|
Sheet
|
Liquid
|
| Mold shrinkage | % | 0.1 | 0.01 | -0.05 |
| Tg | ℃ | 210 | 190 | 160 |
| C.T.E.1 | ppm/℃ | 9 | 7 | 12 |
| C.T.E.2 | ppm/℃ | 52 | 21 | 45 |
| F.Modulus (R.T.) | GPa | 9 | 15 | 14 |
The above data are typical values and not guaranteed values.
