- Available in forms of granule according to the required encapsulation thickness and size, enabling compression molding.
- Respond to growing size and low warpage of thin packages and contribute to the increased productivity of advanced semiconductor packages.
Semiconductor Encapsulation Materials
- Part Number
- Detailed use
Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices.
FOWLP Technology Trend
Contribute to low warpage and thinner product
Line-up and corresponding package
We have wide range of Encapsulation Line-up for WLP/PLP
Wafer Level / Panel Level
Chip First / Chip Last
|Flexural modulus (25°C)||GPa||8||31|
The above data are typical values and not guaranteed values.