- Available in forms of granule according to the required encapsulation thickness and size, enabling compression molding.
- Respond to growing size and low warpage of thin packages and contribute to the increased productivity of advanced semiconductor packages.
Semiconductor Encapsulation Materials
- Part Number
CV8511CUB (EMC)
- Application
- Detailed use
・Package
・Mobile
・Mobile
Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices.
Topics
Properties
Low stress
Low shrinkage
Low temp.curability
FOWLP Technology Trend
Contribute to low warpage and thinner product
Line-up and corresponding package
We have wide range of Encapsulation Line-up for WLP/PLP
Encapsulation method
General properties
| Item | Unit | LEXCM CF CV8511CUB |
LEXCM CF X85U-PT1-AP |
| Mold Size | – |
Wafer Level / Panel Level
|
|
| Molding | – |
Compression |
|
| Process | – |
Chip First / Chip Last |
|
| Form | – |
Granule
|
|
| Mold shrinkage | % | 0.15 | 0.07 |
| Tg | °C | 210 | 174 |
| C.T.E.1 | ppm/°C | 8 | 7 |
| C.T.E.2 | ppm/°C | 56 | 25 |
| Flexural modulus (25°C) | GPa | 8 | 31 |
The above data are typical values and not guaranteed values.
