- MUF materials realize underfilling to the narrow gap under flip-chip without void and overmolding the die at the same mold shot
- Provide a better solution based on high loading technology of fine filler and resin design technology
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV8710 CV8713
- Application
- Detailed use
・PKG
・Mobile
・Mobile
Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.)
Press Release
Features
Saving process time
Excellent fillability
for Narrow gap/pitch
for Narrow gap/pitch
Low warpage
Process comparison
Excellent fillability for Narrow gap and pitch
Application
General properties
| Item | Unit | CV8710TAC | CV8710TLC | CV8710U | CV8715BU | X8710U-F1 | CV8713 |
| EMC type | – | Green | Green | Green | Green | Green | Green |
| Filler cut point | µｍ | 30 | 20 | 10 | 20 | ||
| Flexural modulus (R.T.) | GPa | 24 | 20 | 25 | 12 | 25 | 25 |
| Tg (TMA) | °C | 135 | 150 | 143 | 140 | 156 | 145 |
| C.T.E.1 | ppm/°C | 10 | 13 | 10 | 21 | 10 | 10 |
| Mold shrinkage | % | 0.20 | 0.30 | 0.21 | 0.55 | 0.19 | 0.20 |
The above data are typical values and not guaranteed values.
