Capillary Underfill(CUF) Semiconductor encapsulation materials | CV5300 series

Capillary Underfill(CUF) Semiconductor encapsulation materials

 

  1. Capillary underfill material with reduced void, that realizes underfilling to the narrow gap and pitch by high fluidity.

Semiconductor Encapsulation Materials

  •  Part Number 

CV5300 series

  • Application
  • Detailed use
Package
Mobile
・Package
・Mobile
High-density Advanced IC Packages(BGA, CSP, etc.)

Properties

High fluidity
Excellent fillability
for Narrow gap/pitch
Reduced void/bleed

Line-up

Line-up

Excellent fillability for Narrow gap/pitch

Excellent fillability for Narrow gap/pitch

Reduced void/bleed

Reduced void/bleed

General properties

Item Unit CV5300 series
Filler size Max μm 1
C.T.E. ppm/℃ 33
Tg (TMA) 110
Modulus GPa 7

The above data are typical values and not guaranteed values.

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