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Device-related Systems

Strengths of Panasonic device-related systems

Total support for customers from verification to mass production

We provide full support to our customers through the verification of each semiconductor manufacturing process at our verification center.

Image: Total support for customers from verification to mass production

Products

List by process

Semiconductor-related system lineup by process


Semiconductor-related system lineup by process

Die bonders and flip-chip bonders

The MD-P series high-performance bonders contribute to the miniaturization and functionality enhancement of devices and modules.
Capable of high-quality mounting of various devices, improving the yield.


Die Bonder MD-P200

Die Bonder

MD-P200

Bonding device that is compatible with various bonding processes for state-of-the-art device assembly.

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Flip-chip Bonder MD-P300

Flip-chip Bonder

MD-P300

Supports φ300 mm wafer supply. Realizes high-speed and high-accuracy flip-chip bonding applicable to COW bonding too.

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Flip-chip Bonder MD-P200US2

Flip-chip Bonder

MD-P200US2

Specialized ultrasonic flip-chip machine. Uses proprietary US tool and achieves a consistent quality.

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Dry etchers

APX300 is a batch-type dry etching machine capable of high-speed and high-precision processing.
A variety of processing technologies accumulated through mass-production contribute to the development and production of devices such as LEDs, SAW-F, and MEMS.


Dry Etcher APX300

Dry Etcher

APX300

Housing multiple devices in one box contributes to increase in area productivity.

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Dry Etcher APX300 (S option)

Dry Etcher

APX300 (S option)

The E620 process chamber with extensive track record is bonded on the latest APX300 platform.

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Plasma cleaners

The PSX307 series parallel plate plasma cleaners are designed for PCB cleaning and surface modification, and ready for automatic transfer. They improve the adhesion and bonding performance during the packaging process, ensuring the high quality required for communication and automotive devices.


Plasma Cleaner PSX307

Plasma Cleaner

PSX307/PSX307-HSA

Equipped with a loader and unloader. For PCBs.

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Plasma Cleaner PSX307A

Plasma Cleaner

PSX307A

Large chamber. PCB/wafer selectable.

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Plasma dicer

APX300-DM is a plasma dicing machine capable of high-speed and high-precision processing.
Damage- and particle-free processing with a reduced dicing width improves processing quality and productivity.


Plasma Dicer APX300-DM

Plasma Dicer 

APX300-DM

Reduces damages, takes more chips and increases productivity with the next generation plasma dicing technology.

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Features of Panasonic semiconductor-related systems

Bonders

The lineup of MD-P series provides the optimum mounting accuracies and methods for customers’ various devices. The MD-P300 series, which supports FOWLP, and the MD-P200 series, which uses Panasonic’s original ultrasonic technology, contribute to the production of miniaturized packages.

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Image: Bonders

Dry etchers

The APX300 generates a high density and highly uniform large-area plasma, contributing to the production of devices such as SAW-F, power devices, LEDs, and MEMS. The multiple ESC electrodes directly pick up individual PCBs to improve the cooling efficiency and reproducibility.

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Image: Dry etchers

Plasma cleaners

The PSX307 series contributes to high-quality packaging with Panasonic’s original plasma technology that help modify the surfaces of objects, leading to the improvement of the bonding performance for wire bonding and flip-chip bonding and wettability of mold and underfill materials.

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Plasma cleaners

Plasma dicers

APX300-PD is capable of damage- and chipping-free dicing while achieving higher productivity than the blade or other conventional methods. The particle-free dicing of chip components of various shapes and layouts contributes to the production of advanced packages.

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Plasma dicers

Electronic materials

Dielectric adhesives for bonders and insulating adhesives.

View List of Electronic Materials

Electronic materials

Exhibition and Seminar Information

半導体関連システム 展示会・セミナーの紹介

Information on current seminars and exhibitions is posted here. Information on past seminars and exhibitions is also available.

View List of Exhibitions and Seminars

Custom Service

Maintenance solution

Maintenance solution

Panasonic provides reliable lifetime product support to customers ranging from installation to replacement.

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Demonstration centers for semiconductor-related systems

Mounting Center

Dry etching / Plasma dicing / plasma cleaning / Die bonding / Flip-chip bonding

  • Verification
  • Demonstration

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Library

Video library

Video library

You can view a list of product and business introduction videos.
We will be adding new videos as they become available.

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Feature stories about our technology


Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers

Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers

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Panasonic’s vision for a sustainable future

Initiatives for Mounting Machines under Panasonic Green Impact

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Inquiries

ご相談窓口
各種ご相談は、下記までお問い合わせください。
受付時間 9:00~17:00(土日、祝日、年末年始、弊社所定の休日を除く)